Sb元素对Sn-0.7Cu钎料熔点及钎焊界面的影响

陈雷达; 孟工戈; 刘晓晶; 李正平

Sb元素对Sn-0.7Cu钎料熔点及钎焊界面的影响

Influence of Sb on Sn-0.7Cu solder' s melting point and soldering interface

摘要

摘要: 应用扫描电镜和差示扫描量热仪研究Sb元素(0.25%,0.5%,0.75%,1.0%)对Sn-0.7Cu钎料熔点及钎焊界面的影响。结果表明,Sb元素的加入使钎料的熔点升高,从226.38℃增加到227.09℃,但含量小于0.75%时熔点的变化不大,当Sb元素的含量达到1.0%时变化较大。当Sb元素的含量达到0.5%时,界面化合物的形貌发生了很大变化,扇贝状金属间化合物层变得均匀平滑,避免了大柱状的Cu₆Sn₅相的生成,厚度也变小,明显地抑制了金属间化合物的生长,细化了晶粒。当Sb元素的含量大于0.5%时,界面又出现大柱状的Cu₆Sn₅相,且界面化合物层的厚度增大。Sb元素的加入并未改变界面处金属间化合物的种类。

Abstract: The influences of Sb (0.25%, 0.5%, 0.75% and 1.0%)on Sn -0.7Cu lead-free solder's melting point and soldering interface was studied by scanning electron microscope and differential scanning calorimetry equipment.The result indicates that the melting point raises from 226.38℃ to 227.09℃ as Sb was added into the SnCu solders from 0.25% to 1.0%.But the melting point changed a little when Sb is less than 0.75%, only when its content comes up to 1.0% the melting point changed obviously. When SnCu solder contains 0.5% Sb, the pattern of IMC(intermetallis compound)changes obviously, scalloplike IMC becomes smooth and the thickness of IMC becomes small and big prismatical Cu₆Sn₅ is avoided;the growth of IMC is inhibited and the grain is refined. When more than 0.5% Sb is added into the solder, the big prismatical Cu₆Sn₅ is formed again and IMC becomes thicker.The spiece of IMC wasn't changed when Sb is added into Sn-0.7Cu solder.

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