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王慧, 薛松柏, 陈文学, 王俭辛. Ag,Al,Ga对Sn-9Zn无铅钎料润湿性能的影响[J]. 焊接学报, 2007, (8): 33-36,44.
引用本文: 王慧, 薛松柏, 陈文学, 王俭辛. Ag,Al,Ga对Sn-9Zn无铅钎料润湿性能的影响[J]. 焊接学报, 2007, (8): 33-36,44.
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WANG Hui, XUE Songbai, CHEN Wenxue, WANG Jianxin. Effect of Ag, Al, Ga addition on wettability of Sn-9 Zn lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (8): 33-36,44.
Citation: WANG Hui, XUE Songbai, CHEN Wenxue, WANG Jianxin. Effect of Ag, Al, Ga addition on wettability of Sn-9 Zn lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (8): 33-36,44.
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Ag,Al,Ga对Sn-9Zn无铅钎料润湿性能的影响

Effect of Ag, Al, Ga addition on wettability of Sn-9 Zn lead-free solder

    摘要
  • 摘要: 采用润湿平衡法测试了Sn-9Zn-X(X为Ag,Al,Ga)无铅钎料分别配合ZnCl2-NH4Cl钎剂和免清洗助焊剂,在空气和氮气保护的两种条件下的润湿性能,分析研究了合金元素Ag,Al,Ga的添加量对Sn-9Zn-X无铅钎料润湿性的影响规律。结果表明,合金元素Ag,Al,Ga在Sn-9Zn中的最佳添加量(质量分数)分别为0.3%,0.005%~0.02%,0.5%。采用氮气保护可以显著改善Sn-9Zn-X无铅钎料的润湿性,而Sn-9Zn-X无铅钎料配合ZnCl2-NH4Cl钎剂时具有较好的润湿性,甚至优于Sn-3.5Ag-0.5Cu在相同条件下的润湿性。这一研究结果表明,通过研发适合于Sn-Zn系无铅钎料的高性能助焊剂,从而改善Sn-Zn系钎料的润湿性能是完全可行的。

     

    Abstract: Wettability of Sn-9Zn-X (Ag, Al, Ga)leadfree solder, with non-cleaning flux and ZnCl2-NH4Cl flux, was appraised by means of wetting balance method in air and N2 atmospheres; the effect of different additive amount of Ag, Al, Ga on the wettability of Sn-9Zn-X solders was studied.The results indicate that the optimum additive amount of Ag, Al, Ga in Sn-9Zn solder is 0.3, 0.005-0.02 and 0.5 mass percent, respectively.Thewet-tability of Sn-9Zn-X can be obviously improved in N2 atmospheres.It is also found that Sn-9Zn-X lead-free solders show preferable wettability with ZnCl2-NH4Cl flux, even better than that of Sn-3.5Ag-0.5Cu solder under the same condition, which may reveal the feasibility of improving the wettability of Sn-Zn series lead-free solders by developing suitable flux.

     

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