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王克鸿, 李建勇, 嵇大圆, 张德库. 熔化带极自动等离子熔敷焊接纯铜技术[J]. 焊接学报, 2007, (5): 13-16.
引用本文: 王克鸿, 李建勇, 嵇大圆, 张德库. 熔化带极自动等离子熔敷焊接纯铜技术[J]. 焊接学报, 2007, (5): 13-16.
WANG Kehong, LI Jianyong, JI Dayuan, ZHANG Deku. Pure copper coating deposited by automatic plasma welding with melting strip electrode technology[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (5): 13-16.
Citation: WANG Kehong, LI Jianyong, JI Dayuan, ZHANG Deku. Pure copper coating deposited by automatic plasma welding with melting strip electrode technology[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (5): 13-16.

熔化带极自动等离子熔敷焊接纯铜技术

Pure copper coating deposited by automatic plasma welding with melting strip electrode technology

  • 摘要: 针对管形工件表面焊接铜熔敷层,设计研究了熔化带极自动等离子熔敷焊接工艺,铜带采用被动式自动送进方式进入焊接区,等离子弧产生于钨极和铜带之间,对焊接区喷吹保护剂,等离子电弧熔化铜带在钢基体表面熔敷铜金属层,焊接过程稳定,外观成形优良。结果表明,采用等离子弧熔敷焊接铜带,可以得到1~6mm厚的熔敷层,保证在钢基体不发生熔化的基础上实现纯铜和基体金属之间的焊接,抗剪强度超过150MPa,也大于铜熔敷层自身的强度,结合质量优良,没有气孔、未焊合、夹渣等焊接缺陷。SEM和EDAX检测表明,纯铜熔敷层与基体扩散形成冶金结合,在界面铜熔敷层侧10~30μm内,Fe元素含量已降至1%以内。

     

    Abstract: For tubular workpiece surface deposited by Cu, the process of deposition by automatic plasma welding with melting strip electrode was designed and researched.The Cu strip electrode enters the welding region with the passive automatic feed-in manner. The plasma arc burns between the tungsten, and copper strip and the protective agent is blown into the welding region.The plasma arc makes the copper strip melt, and the Cu deposited layer was formed on the base metal surface of steel.The welding process is stable and the weld appearance is excellent.The detected results show that the deposited layer of of pure copper with 1 -6 mm thickness can be gotten.The pure copper and the base metal can be welded together without the base metal being molten.The shear strength exceeds 150MPa, which is greater than the strength of Cu layer.The bonding quality is excellent and there is no welding defects such as gas pore, incomplete fusion and slag inclusion.The SEM and EDAX results show that metallurgical bonding by diffusion is formed between the deposited pure copper layer and the base metal.And within the distance of 10 -30 μm from the side of the deposited copper layer interface, the content of Fe decreases to less than 1%.

     

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