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刘宏, 冯吉才, 何鹏. 置氢质量分数0.15%Ti6Al4V合金扩散连接[J]. 焊接学报, 2007, (3): 97-100.
引用本文: 刘宏, 冯吉才, 何鹏. 置氢质量分数0.15%Ti6Al4V合金扩散连接[J]. 焊接学报, 2007, (3): 97-100.
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LIU Hong, FENG Jicai, HE Peng. Diffusion bonding of hydrogenated Ti6Al4V alloy containing 0. 15 wt.% hydrogen[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (3): 97-100.
Citation: LIU Hong, FENG Jicai, HE Peng. Diffusion bonding of hydrogenated Ti6Al4V alloy containing 0. 15 wt.% hydrogen[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2007, (3): 97-100.
shu

置氢质量分数0.15%Ti6Al4V合金扩散连接

Diffusion bonding of hydrogenated Ti6Al4V alloy containing 0. 15 wt.% hydrogen

    摘要
  • 摘要: 采用真空扩散连接技术对置氢质量分数0.15%Ti6Al4V合金进行了焊接。利用扫描电镜、电子探针、X射线衍射分析手段研究了置氢质量分数0.15%Ti6Al4V合金母材焊接前后的相组成、接头界面结构及连接工艺参数对界面扩散孔隙的影响。结果表明,焊前母材组织为长条状α+片层状(α+βH),焊后母材组织为等轴α+粗片层状(α+β)+β相上α'马氏体,在扩散连接过程中,α相中V元素扩散到βH相中,βH相中Al元素扩散到α相中。随着连接温度的升高,连接时间的延长和连接压力的增大,界面的扩散孔隙逐渐减少,当连接温度达到850℃,压力为12 MPa,连接时间为60 min时,扩散孔隙消失,接头抗剪强度高达543 MPa。

     

    Abstract: The diffusion bonding of hydrogenated Ti6Al4V alloy containing 0.15 wt.% hydrogen was carried out, and the phase component of before and after welding, interface structure and the diffusion holes were investigated by means of scanning electron microscope, electron probe microanaly sis and X-ray diffraction.The results showed the phase component of before welding was black strip αplus lamellar (α+βH), and the after was equiaxed αplus the coarse lamellar (α+β)plus hexagonal close packed α'in the β phase.The diffusion of Al and V in αand βH took place during bonding.With the diffusion bonding parameters increasing, the diffusion holes gradually decreased.When bonded at 850℃ for 60 min under a pressure of 12 MPa, the diffusion holes disappeared and the shear strength of the joint was up to 543 MPa.

     

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