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王旭艳, 薛松柏, 王海松, 禹胜林. Sn-Ag-Cu表面贴装元件的水清洗技术[J]. 焊接学报, 2005, (10): 109-112.
引用本文: 王旭艳, 薛松柏, 王海松, 禹胜林. Sn-Ag-Cu表面贴装元件的水清洗技术[J]. 焊接学报, 2005, (10): 109-112.
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WANG Xu-yan, XUE Song-bai, WANG Hai-song, YU Sheng-lin. Water cleaning technology for surface mounted components soldered with Sn-Ag-Cu solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 109-112.
Citation: WANG Xu-yan, XUE Song-bai, WANG Hai-song, YU Sheng-lin. Water cleaning technology for surface mounted components soldered with Sn-Ag-Cu solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2005, (10): 109-112.
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Sn-Ag-Cu表面贴装元件的水清洗技术

Water cleaning technology for surface mounted components soldered with Sn-Ag-Cu solder

    摘要
  • 摘要: 采用SMT450-LD全自动SMT水清洗系统对模拟试件和贴装有片式电阻的PCB板表面残留物采用水基清洗剂清洗。结果表明,用Sn-Ag-Cu免清洗焊膏贴装在FR4基板上的片式电阻,焊后采用水基清洗剂清洗,表面残留物离子浓度为1.9μg/cm2,达到美国军用标准MIL-STD-2000小于5.7μg/cm2的规定。清洗过程中参数的设置,如清洗温度,清洗时间会对清洗效果产生较大影响。

     

    Abstract: Simulative specimens and SMC soldered with layer resistances were cleaned by SMT450-LD SMT water-cleaning system and the results indicate that the layer resistance mounted on FR4 by Sn-Ag-Cu no-cleaning solder paste is clean and the residua concentrateion on PCB surface is about 1.9μg/cm2,which met the requirement of MIL-STD-2000(the residua concentrateion on PCB surface should be less than 5.7μg/cm2).Cleaning parameters such as cleaning temperature and cleaning time have great effects on the cleaning result.

     

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