半导体激光钎焊工艺参数对QFP器件微焊点强度的影响

Effect of diode-laser parameters on tensile strength of QFP micro-joints

College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China

摘要: 采用90 W半导体激光软钎焊系统对方形扁平式封装器件(QFP)进行了焊接试验研究,并对不同激光输出功率下形成的QFP结构焊点进行了力学性能比较。研究结果表明,半导体激光软钎焊不仅能够大幅度地提高Sn-Ag-Cu钎料QFP微焊点的抗拉强度,而且也能够明显地改善Sn-Pb钎料QFP微焊点的抗拉强度。在相同的钎料成分下,半导体激光输出功率直接影响QFP焊点的抗拉强度,研究结果可为提高QFP微焊点强度和可靠性提供一个有效的解决方法。
- 激光软钎焊 /
- 方形扁平式封装器件 /
- 抗拉强度
Abstract: Soldering technology for quad flat pack devices(QFP) were studied by means of 90W diode-laser soldering system and the mechanical properties of micro-joints of QFP were compared with different laser power.Results indicate that diode-laser soldering can obviously improve both the tensile strength of the joints with Sn-Ag-Cu solder and the strength of the joints with Sn-Pb solder.The diodelaser output power directly influences the tensile strength of the micro-joints of QFP with the same solders.These results will provide a good method for improving the strength and reliability of fine pitch QFP devices.
- laser soldering /
- QFP /
- tensile strength

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