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季杰, 井绪贵, 张文钺. 铜渗透裂纹机理[J]. 焊接学报, 2004, (3): 124-128.
引用本文: 季杰, 井绪贵, 张文钺. 铜渗透裂纹机理[J]. 焊接学报, 2004, (3): 124-128.
JI Jie, JING Xu-gui, ZHANG Wen-yue. Mechanism of infiltrated cracks by copper[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2004, (3): 124-128.
Citation: JI Jie, JING Xu-gui, ZHANG Wen-yue. Mechanism of infiltrated cracks by copper[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2004, (3): 124-128.

铜渗透裂纹机理

Mechanism of infiltrated cracks by copper

  • 摘要: 深入探讨了温度、保温时间、含镍量、含硼量、堆焊工艺规范、外界应变等条件对渗透裂纹的影响规律。通过金相、电镜分析研究了渗透裂纹的机理采用正交试验方法及线性回归分析建立了无应力状态下渗透深度与温度、保温时间、含镍量和含硼量的回归方程。并采用了点加热可变拘束试验方法研究了堆焊工艺规范及应变量对渗透裂纹深度的影响规律。结果发现铜合金在母材晶界处的快速扩散是形成渗透裂纹的根本原因,而铜合金的润湿铺展及拉应力的作用是渗透裂纹形成及扩展的诱因。

     

    Abstract: The influence of temperature,holding time,nickelcontent,boron content,surfacing technology,and regularity of outside contingent condition ete on infiltrated crack is deeply discussed.By means of metallographic analysis and electronic microscope analysis,in-filtrated crack mechanism is studied.A regression equation on conditionof no-stress about infiltrated depth,temperature,holding time,nickelcontent and boron content is set up by means of perpendicular test method and liner regression analysis.Surfacing technology and influence regularity of strain on depth of infiltrated cracks are studied with a method of heating changeable restrain in points.It is found that the fast diffusion of copper alloy in grain boundary of base metal and the tensile stress are the main reasons of formation and development of infiltrated cracks.

     

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