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张胜, 侯金保, 郭德伦, 张蕾. MGH956合金TLP连接机理及接头组织分析[J]. 焊接学报, 2004, (3): 43-47.
引用本文: 张胜, 侯金保, 郭德伦, 张蕾. MGH956合金TLP连接机理及接头组织分析[J]. 焊接学报, 2004, (3): 43-47.
shu
ZHANG Sheng, HOU Jin-bao, Guo De-lun, ZHANG Lei. Transient liquid phase bonding mechanism and microstrueture ofMGH956 joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2004, (3): 43-47.
Citation: ZHANG Sheng, HOU Jin-bao, Guo De-lun, ZHANG Lei. Transient liquid phase bonding mechanism and microstrueture ofMGH956 joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2004, (3): 43-47.
shu

MGH956合金TLP连接机理及接头组织分析

Transient liquid phase bonding mechanism and microstrueture ofMGH956 joints

    摘要
  • 摘要: MGH956合金是采用机械合金化方法制造的氧化物弥散强化高温合金,具有高温力学性能好、高温抗氧化和抗腐蚀性能好的综合优势。自行研制了中间层合金KCo1进行MGH956合金过渡液相(TLP)扩散连接试验,分析了接头组织、成分和连接工艺的关系,确定了MGH956合金TLP扩散连接机理。同时,对MGH956合金焊接接头中产生的夹渣缺陷进行了深入的分析。结果表明:在连接温度1240℃、保温8 h条件下,可以获得焊接缺陷少、完整连续的焊接接头。

     

    Abstract: Tile interlayer alloy KCol is developed for transient liquid phase (TLP) diffusion bonding of MGH956 superalloy.The relative as-pects have been analyzed about the mierostrueture of the joint,elementsand bonding technologies.The TLP bonding mechanism of MGH956 superalloy has been verified.At the same time,the residues in the joints ofMGH956 superalloy are analysed further.The experimental results show that the integrated joints without the residues could be attained on the condition of 1 240%/8 h.

     

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