高级检索
杨敏, 邹增大, 刘秀忠, 王育福, CUIFeng-you. Si3N4陶瓷/Inconel 600合金液相诱导扩散连接接头的强度与断裂行为[J]. 焊接学报, 2003, (4): 36-38,42.
引用本文: 杨敏, 邹增大, 刘秀忠, 王育福, CUIFeng-you. Si3N4陶瓷/Inconel 600合金液相诱导扩散连接接头的强度与断裂行为[J]. 焊接学报, 2003, (4): 36-38,42.
shu
YANG Min, ZOU Zeng-da, LIU Xiu-zhong, WANG Yu-fu, CUI Feng-you. Strength and fracture behavior of Si3N4 ceramic/Inconel 600 alloy liquid phase inductive diffusion bonding joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2003, (4): 36-38,42.
Citation: YANG Min, ZOU Zeng-da, LIU Xiu-zhong, WANG Yu-fu, CUI Feng-you. Strength and fracture behavior of Si3N4 ceramic/Inconel 600 alloy liquid phase inductive diffusion bonding joint[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2003, (4): 36-38,42.
shu

Si3N4陶瓷/Inconel 600合金液相诱导扩散连接接头的强度与断裂行为

Strength and fracture behavior of Si3N4 ceramic/Inconel 600 alloy liquid phase inductive diffusion bonding joint

    摘要
  • 摘要: 利用Nb/Cu/Ni复合层作中间层,采用液相诱导扩散连接方法连接了Si3N4陶瓷/Inconel 600合金,用剪切试验评价接头强度,采用扫描电镜(SEM)观察接头的断口形貌,系统地分析了连接压力、连接时间,连接温度对Si3N4陶瓷/Inconel 600合金液相诱导扩散连接接头的强度和断裂行为的影响。结果表明,连接温度(在连接时间为3000 s以及连接压力为5 MPa条件下)、连接压力(在连接温度为1130℃以及连接时间为3000 s条件下)和连接时间(在连接温度为1130℃以及连接压力为10 MPa条件下)都与接头的剪切强度呈抛物线关系。

     

    Abstract: Bonding of Si3N4 ceramic to Inconel 600 alloy was carried out by liquid phase inductive diffusion bonding (LPIDB) method with Nb/Cu/Ni multi-interlayer.Effect of bonding condition on joint strength and fracture behavior was investigated in the paper.Joint strength was evalua-ted by shear test,shear fracture surface of the joint was observed by SEM.It was shown that the parabolic relationship among the shear strength of the joint and bonding temperature (when bonding time is 3000 s and bonding pressure is 5 MPa),bonding pressure (when bonding temperature is 1 130℃ and bonding pressure is 10 MPa) was observed.

     

    • HTML全文
    • 参考文献(0)
    • 相关文章
    • 施引文献
  • 资源附件(0)

/

返回文章
返回