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迟大钊, 郭涛, 张闰琦, 张涛, 申浩. 声阻法胶接结构缺陷实时成像检测[J]. 焊接学报, 2022, 43(11): 107-111. DOI: 10.12073/j.hjxb.20220702001
引用本文: 迟大钊, 郭涛, 张闰琦, 张涛, 申浩. 声阻法胶接结构缺陷实时成像检测[J]. 焊接学报, 2022, 43(11): 107-111. DOI: 10.12073/j.hjxb.20220702001
CHI Dazhao, GUO Tao, ZHANG Runqi, ZHANG Tao, SHEN Hao. Study on real-time imaging detection of bonding defects by acoustic impedance method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(11): 107-111. DOI: 10.12073/j.hjxb.20220702001
Citation: CHI Dazhao, GUO Tao, ZHANG Runqi, ZHANG Tao, SHEN Hao. Study on real-time imaging detection of bonding defects by acoustic impedance method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(11): 107-111. DOI: 10.12073/j.hjxb.20220702001

声阻法胶接结构缺陷实时成像检测

Study on real-time imaging detection of bonding defects by acoustic impedance method

  • 摘要: 为了有效检测胶接结构缺陷,构建了基于声阻法的成像检测系统. 系统包括声学信号采集、声学探头定位、数据处理及绘图三部分. 利用两轮式编码器,实现了动态扫查过程探头位置信息的采集;利用结合质量检测仪采集缺陷信息;采用C + + 编写了数据处理及图像绘制程序,实现了胶接结构缺陷声阻法实时成像检测. 利用声阻法及常规超声C扫描成像方法对铝合金/环氧树脂/铝合金三明治胶接结构进行了检测,并对检测结果进行了分析对比. 结果表明,声阻法能更有效识别胶接结构中的缺陷,且单面检测即可满足缺陷表征需求.

     

    Abstract: In order to detect the bonded structure defects effectively, an imaging inspection system based on acoustic impedance method is constructed. The system includes three parts: acoustic signal acquisition, acoustic probe positioning, data processing and imaging. Probe positions during dynamic scanning are collected using two rotary encoders. The defect data are collected using a Bonding Quality Detector. The data processing and image drawing programs are written in C++ language. The bonded sandwich structure of aluminum alloy/epoxy resin/aluminum alloy was tested using both acoustic impedance and conventional ultrasonic C-scan imaging methods, and the test results were compared and analyzed. The results show that the acoustic impedance based imaging method can identify defects in bonded structures more effectively, and single-sided testing can meet the needs of defect detection.

     

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