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周文婷, 司玉鹏, 何宏舟, 王荣杰. 基于量子多目标优化算法的回焊炉炉温设计[J]. 焊接学报, 2022, 43(1): 85-91. DOI: 10.12073/j.hjxb.20210508001
引用本文: 周文婷, 司玉鹏, 何宏舟, 王荣杰. 基于量子多目标优化算法的回焊炉炉温设计[J]. 焊接学报, 2022, 43(1): 85-91. DOI: 10.12073/j.hjxb.20210508001
ZHOU Wenting, SI Yupeng, HE Hongzhou, WANG Rongjie. Design of reflow oven furnace temperature based on quantum multi-objective optimization algorithm[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(1): 85-91. DOI: 10.12073/j.hjxb.20210508001
Citation: ZHOU Wenting, SI Yupeng, HE Hongzhou, WANG Rongjie. Design of reflow oven furnace temperature based on quantum multi-objective optimization algorithm[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2022, 43(1): 85-91. DOI: 10.12073/j.hjxb.20210508001

基于量子多目标优化算法的回焊炉炉温设计

Design of reflow oven furnace temperature based on quantum multi-objective optimization algorithm

  • 摘要: 电路板焊接中心点的温度走势间接地反映了焊接质量,炉温曲线的优化设计对提高电路板焊接质量有着举足轻重的作用.文中运用傅里叶定律和集总参数法,建立反映电路板焊接中心温度变化的非稳态导热模型,并在满足制程界限和工艺要求的约束条件下,以传送带过炉速度最优和加热因子最小为目标,采用量子多目标粒子群算法(quantum multi-objective particle swarm optimization,QMOPSO)进行优化求解,获得了各温区的最优温度和电路板的最大过炉速度,并得到了最优炉温曲线.结果表明,优化后的电路板过炉速度为95.55 cm/min,接近速度上限,加热因子最小值为1753.04,炉温曲线整体呈现先上升后下降的趋势,峰值温度为240.01 ℃,接近温度制程界限下限,该结果为电路板等电子器件焊接工艺的实际工程应用和提高焊接质量提供参考.

     

    Abstract: The temperature trend of the welding center of circuit board indirectly reflects the welding quality. The optimization design of furnace temperature curve plays an important role in improving the welding quality of circuit board. In this paper, Fourier law and lumped parameter method were used to establish the unsteady heat conduction model reflecting the temperature change of the welding center of the circuit board. Under the constraints of meeting the process limits and technological requirements, the quantum multi-objective particle swarm optimization algorithm was used to optimize the solution with the goals of the optimal conveyor belt passing furnace speed and the minimum heating factor. The optimum temperature of each temperature region, the maximum passing speed of circuit board and the optimum temperature curve were obtained. The results show that the optimized circuit board passing through the furnace speed is 95.55 cm/min, which is close to the upper limit of the speed limit, and the minimum heating factor is 1 753.04. The furnace temperature curve shows a trend of rising first and then decreasing. The peak temperature is 240.01 ℃, which is close to the lower limit of the temperature process. The results provide strong guidance for practical engineering application and improvement of welding quality of electronic devices such as circuit boards.

     

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