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黄俊兰, 龙伟民, 钟素娟, 耿进锋, 丁天然, 秦建. Ni-P镀层对Cu/Al钎焊界面结构及性能的影响机制[J]. 焊接学报, 2021, 42(5): 51-56, 70. DOI: 10.12073/j.hjxb.20201127001
引用本文: 黄俊兰, 龙伟民, 钟素娟, 耿进锋, 丁天然, 秦建. Ni-P镀层对Cu/Al钎焊界面结构及性能的影响机制[J]. 焊接学报, 2021, 42(5): 51-56, 70. DOI: 10.12073/j.hjxb.20201127001
HUANG Junlan, LONG Weimin, ZHONG Sujuan, GENG Jinfeng, DING Tianran, QIN Jian. Effect mechanism of Ni-P coating on the structure and properties of Cu/Al joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(5): 51-56, 70. DOI: 10.12073/j.hjxb.20201127001
Citation: HUANG Junlan, LONG Weimin, ZHONG Sujuan, GENG Jinfeng, DING Tianran, QIN Jian. Effect mechanism of Ni-P coating on the structure and properties of Cu/Al joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2021, 42(5): 51-56, 70. DOI: 10.12073/j.hjxb.20201127001

Ni-P镀层对Cu/Al钎焊界面结构及性能的影响机制

Effect mechanism of Ni-P coating on the structure and properties of Cu/Al joints

  • 摘要: 为了研究Ni-P镀层对Cu/Al异种金属钎焊界面反应的影响,首次采用Zn98Al和BAl67CuSi两种钎料对含/不含Ni-P镀层的T2紫铜与3003铝合金进行了高频钎焊,获得4种不同的钎焊接头,分别对接头Cu侧界面结构、抗剪强度、断口形貌、显微硬度及弯曲形貌进行了系统研究,并与无镀层接头进行对比. 结果表明,T2表面镀覆Ni-P后,Cu/Zn98Al/Al接头中Cu基体/钎缝界面结构由扩散层+8.8 μm厚的Cu3.2Zn4.2Al0.7化合物转变为1.5 μm厚的Al3Ni化合物,而Cu/BAl67CuSi/Al接头中Cu基体/钎缝界面结构由扩散层+15 μm厚CuAl2转变为1.8 μm厚Cu3NiAl6;与无镀层接头相比,镀覆Ni-P后,Cu/Zn98Al/Al接头强度略有上升,Cu/BAl67CuSi/Al接头强度略有下降,但两种接头的韧性均明显增强,力学性能试验结果与接头Cu侧界面微观组织转变规律相符. 最后建立了Cu/Al接头的界面反应模型,并阐明了Ni-P镀层对Cu/Al接头界面结构和力学性能的影响机制.

     

    Abstract: To investigate the influence of Ni-P coating on the interfacial reaction of Cu/Al dissimilar metal brazing, two brazing filler metals, Zn98Al and BAl67CuSi, were first used to braze 3003 aluminum alloy and T2 copper with or without Ni-P coating. Four different brazing joints were obtained. The Cu side interfacial microstructure, joint shear strength, joint fracture morphology, joint microhardness and joint bending morphology were systematically studied. Additionally, the joints without Ni-P coating were also used for comparison. The results showed that the interfacial structure of the Cu/Zn98Al/Al brazed joint was Cu/diffusion layer+8.8 μm thickness Cu3.2Zn4.2Al0.7. After the preparation of the Ni-P coating on the T2 copper surface, the interfacial structure transformed into Ni-P coating+1.5 μm thickness Al3Ni, which leaded to the higher strength and toughness. However, the interfacial structure of the Cu/BAl67CuSi/Al brazed joint changed from diffusion layer+15 μm thickness CuAl2 to Ni-P coating+1.8 μm thickness Cu3NiAl6, which leaded to the higher toughness but the lower strength. The effect mechanism of Ni-P coating on the interfacial reaction of Cu/Al joint was clarified. The mechanical properties test results were consistent with the microstructure transition of the Cu side interface of the joint. Finally, the interfacial reaction model of the Cu/Al joint was established, and the influence mechanism of Ni-P coating on the interfacial structure and mechanical properties of the Cu/Al joint was illustrated.

     

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