Sn-9Zn-0.1S/Cu焊点液固界面金属间化合物的生长动力学
Growth kinetics of intermetallic compounds formation between liquid Sn-9Zn-0.1S solders and Cu substrates interface
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摘要: 采用扫描电镜和光学显微镜观察研究了230~260℃焊接温度范围内Sn-9Zn-0.1S/Cu焊点界面金属间化合物的结构及生长动力学.结果表明，在该焊点界面形成的化合物可分为两层：靠铜侧的是厚且平直的γ-Cu5Zn8化合物层；靠焊料侧的则为另一薄且呈扇贝、粒状的CuZn化合物层.提高钎焊温度及延长反应时间基本不改变Sn-9Zn-0.1S/Cu焊点界面金属间化合物的结构和成分，但会使形成的界面金属间化合物层厚度增加.γ-Cu5Zn8金属间化合物层的厚度与反应时间的平方根呈线性关系，表明其生长由扩散机制控制.根据阿伦尼乌斯公式，Sn-9Zn-0.1S/Cu焊点界面γ-Cu5Zn8金属间化合物层反应活化能为22.09 kJ/mol.Abstract: The microstructure and growth kinetics of intermetallic compounds formed during the soldering reactions between Sn-9Zn-0.1S solders and Cu substrates at various temperatures ranging from 230 to 260℃ were investigated using scanning electron microscope and optical microscope. The results indicate that a thick planar layer of γ-Cu5Zn8 next to Cu substrate and a thin particulate layer of CuZn adjacent to solder can be formed at the Sn-9Zn-0.1S/Cu interface, and the constituent of the interfacial intermetallics do not change with the increase of soldering temperature and the prolonged reaction time, while the thickness of γ-Cu5Zn8 layer increases with the soldering temperature and reaction time. The relationship between the thickness of γ-Cu5Zn8 layer and the square root of reaction time fits linear, which shows that the growth of the intermetallic layer is diffusion-controlled. Kinetics analysis indicated that the activation energy of the intermetallic growth was 22.09 kJ/mol.
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Keywords:
- lead free solder /
- Sn-Zn /
- intermetallic compound /
- soldering temperature /
- activation energy
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