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型面约束下的真空钎焊金刚石工艺及其等高性分析

赫青山, 崔仲鸣, 傅玉灿, 王志新

赫青山, 崔仲鸣, 傅玉灿, 王志新. 型面约束下的真空钎焊金刚石工艺及其等高性分析[J]. 焊接学报, 2020, 41(2): 39-42. DOI: 10.12073/j.hjxb.20191106006
引用本文: 赫青山, 崔仲鸣, 傅玉灿, 王志新. 型面约束下的真空钎焊金刚石工艺及其等高性分析[J]. 焊接学报, 2020, 41(2): 39-42. DOI: 10.12073/j.hjxb.20191106006
HE Qingshan, CUI Zhongming, FU Yucan, WANG Zhixin. Vacuum brazing diamond process under the profile constraint and analysis of agreed height abrasives[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(2): 39-42. DOI: 10.12073/j.hjxb.20191106006
Citation: HE Qingshan, CUI Zhongming, FU Yucan, WANG Zhixin. Vacuum brazing diamond process under the profile constraint and analysis of agreed height abrasives[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(2): 39-42. DOI: 10.12073/j.hjxb.20191106006

型面约束下的真空钎焊金刚石工艺及其等高性分析

基金项目: 国家自然科学基金资助项目(51775170);国家青年科学基金资助项目(51605144);NSFC-河南联合基金重点项目(U1604254).
详细信息
    作者简介:

    赫青山,1983年出生,博士,副教授;主要从事钎焊超硬磨料工具制备方面的科研和教学工作;发表论文10余篇;Email:qingshan@haut.edu.cn

  • 中图分类号: TG454

Vacuum brazing diamond process under the profile constraint and analysis of agreed height abrasives

  • 摘要: 在真空炉中采用石墨阴模对金刚石进行适当约束的方法开展钎焊试验,实现了金刚石与钢基体之间的高强度连接及磨粒等高性的有效控制. 采用SEM对钎焊试样和金刚石表面形貌进行观察,采用EDS对金刚石表面定点和微区成分进行分析,使用超景深三维显微镜对磨粒等高性进行测量. 结果表明,液相Cu70Sn20Ti10钎料在毛细作用下可润湿包裹在石墨阴模上粘接的金刚石,且两者界面上形成TiC反应物,由此可获得钢基体对金刚石高的把持力. 钎焊过程银胶不与金刚石发生反应,同时由于银胶能够始终保持对金刚石的粘接及约束作用,所以钎焊后的磨粒等高性好.
    Abstract: The brazing experiments in vacuum furnace were carried by a special method of keeping diamond within the bounds of graphite template, which realized a high bonding strength between steel matrix and diamond and an effective way to control agreed height abrasives. Welded joints and morphology of diamond surface were observed by SEM. Fixed-point and micro-region compositions on the diamond surface were analyzed by EDS. The agreed height abrasives were measured by super-field 3D microscope. Results show that liquefied Cu70Sn20Ti10 solder under capillary action can infiltrate and enclose diamond on the profile of graphite template through splicing and steel matrix have a high holding power for diamond due to the formed TiC on bonding interfaces. Silver colloid and diamond can't generate reaction during brazing process. As silver colloid can always have good bonding and constraint effect for diamond, agreed height of abrasives is satisfactory after brazing process.
  • 图  1   钎焊试样结构示意图

    Figure  1.   Welded joint structure diagram

    图  2   真空钎焊后的金刚石形貌

    Figure  2.   Morphology of vacuum brazed diamond. (a) half parcel diamond; (b) full parcel diamond

    图  3   金刚石粘接断面形貌

    Figure  3.   Morphology of diamond bonding section

    图  4   银胶残留物能谱分析

    Figure  4.   EDX analysis of silver glue residue

    图  5   腐蚀后的金刚石形貌

    Figure  5.   Morphology of diamond after etching

    图  6   金刚石界面生成物形貌及其能谱分析

    Figure  6.   Morphology of reactants and their EDX analysis. (a) interface reactants; (b) element of reactants

    图  7   钎焊试样的宏观形貌

    Figure  7.   Morphology of welded joint

    图  8   钎焊试样的磨粒等高性

    Figure  8.   Agreed height abrasives of welded joint

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出版历程
  • 收稿日期:  2019-11-05
  • 网络出版日期:  2020-07-12
  • 刊出日期:  2020-01-31

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