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杨宗辉, 沈以赴, 初雅杰, 成家林, 李晓泉. 钴/镍复合中间层真空扩散连接钨与钢[J]. 焊接学报, 2020, 41(3): 54-58. DOI: 10.12073/j.hjxb.20190823003
引用本文: 杨宗辉, 沈以赴, 初雅杰, 成家林, 李晓泉. 钴/镍复合中间层真空扩散连接钨与钢[J]. 焊接学报, 2020, 41(3): 54-58. DOI: 10.12073/j.hjxb.20190823003
YANG Zonghui, SHEN Yifu, CHU Yajie, CHENG Jialin, LI Xiaoquan. Tungsten/steel vacuum diffusion bonding using Co/Ni composite interlayer[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(3): 54-58. DOI: 10.12073/j.hjxb.20190823003
Citation: YANG Zonghui, SHEN Yifu, CHU Yajie, CHENG Jialin, LI Xiaoquan. Tungsten/steel vacuum diffusion bonding using Co/Ni composite interlayer[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2020, 41(3): 54-58. DOI: 10.12073/j.hjxb.20190823003

钴/镍复合中间层真空扩散连接钨与钢

Tungsten/steel vacuum diffusion bonding using Co/Ni composite interlayer

  • 摘要: 以钴粉/镍箔为复合中间层,采用800,900和1 000 ℃等三种连接温度,加压10 MPa并保温120 min的工艺条件,对钨/钢真空扩散连接. 研究了接头的微观组织、成分分布、力学性能及断口特征. 结果表明,连接温度为800 ℃和900 ℃时,钨/中间层界面金属间化合物生成很少,对应接头抗剪强度分别为186 MPa和172 MPa,断口均位于钨母材中近界面的位置,为典型解理断裂形貌;当连接温度升至1 000 ℃时,钨/中间层界面生成厚度小于2 μm的连续金属间化合物层,接头抗剪强度降至115 MPa,断裂也发生在钨母材中近界面的位置,断口大部分区域为沿晶断裂特征.

     

    Abstract: Diffusion bonding between Tungsten and Steel using Co powder/Ni foil composite interlayer was carried out under the condition of 10 MPa in vacuum at 800 ℃, 900 ℃ and 1 000 ℃ for 120 minutes. The microstructure, composition, fracture characteristic and shear strength of the joints were studied. The results showed that less intermetallic compound is formed in tungsten matrix/interlayer interface of the joints bonding at 800 ℃ and 900 ℃, the shear strength of the corresponding joints is 186 MPa and 172 MPa, respectively. The shear fracture of the joints ,which is typical cleavage fracture morphology, are located in tungsten matrix near interface.When the bonding temperature is up to 1 000 ℃, a continuous intermetallic compound layer less than 2 μm is formed in the tungsten/interlayer interface, the shear strength of the joints reduced significantly to 115 MPa. The shear fracture of the joints bonding at 1 000 ℃ is also located in tungsten matrix near interface. Most of which exhibits intergranular fracture morphology.

     

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