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贾克明,王丽凤,张世勇,刘海涛. BGA单板结构与板级结构焊点剪切力学行为分析[J]. 焊接学报, 2018, 39(3): 94-98. DOI: 10.12073/j.hjxb.2018390076
引用本文: 贾克明,王丽凤,张世勇,刘海涛. BGA单板结构与板级结构焊点剪切力学行为分析[J]. 焊接学报, 2018, 39(3): 94-98. DOI: 10.12073/j.hjxb.2018390076
JIA Keming, WANG Lifeng, ZHANG Shiyong, LIU Haitao. Analysis of shear mechanical behavior of solder joints in BGA in veneer structure and board-level structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(3): 94-98. DOI: 10.12073/j.hjxb.2018390076
Citation: JIA Keming, WANG Lifeng, ZHANG Shiyong, LIU Haitao. Analysis of shear mechanical behavior of solder joints in BGA in veneer structure and board-level structure[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2018, 39(3): 94-98. DOI: 10.12073/j.hjxb.2018390076

BGA单板结构与板级结构焊点剪切力学行为分析

Analysis of shear mechanical behavior of solder joints in BGA in veneer structure and board-level structure

  • 摘要: 采用试验方法研究BGA封装结构中焊点的剪切力学行为. 分析并比较了Sn-3Ag-0.5Cu,Sn-0.3Ag-0.7Cu,Sn-0.3Ag-0.7Cu-0.07La和Sn-0.3Ag-0.7Cu-0.07La-0.05Ce四种钎料焊点在单板结构与板级结构中的力学性能. 结果表明, 单板结构中焊点的抗剪强度高于板级结构中焊点的抗剪强度. 在单板结构中,高银焊点的抗剪强度最大,加入稀土元素的低银焊点只是得到了一定程度上的改善,然而对于板级结构,加入稀土元素的低银焊点剪切力学性能基本与高银焊点相当. 在同等拘束条件下,低银焊点的延展性优于高银焊点. 此外,对于同一种钎料而言,单板结构中的焊点断裂在体钎料上,而板级结构则断裂在IMC/体钎料界面处.

     

    Abstract: The shear behavior of solder joints in BGA package structure is studied by shear experiments. The mechanical properties of four solder joints with Sn-3Ag-0.5Cu, Sn-0.3Ag-0.7Cu, Sn-0.3Ag-0.7Cu-0.07La and Sn-0.3Ag-0.7Cu-0.07La-0.05Ce in the veneer and board-level structure were compared and analyzed. The results show that the shear strength of the solder joints in veneer structure is higher than that of the solder joints in board-level structure. The shear strength of the high-silver solder joints is the largest and the low-silver solder joint with rare earth element has been improved to a certain extent in veneer structure. However, the shear mechanical properties of low-silver solder joints with rare earth elements are basically equivalent to those of high-silver solder joints in board-level structure. The ductility of the low-silver solder joints is better than that of the high-silver solder joints under the same constraint conditions. In addition, for the same solder, the joints in veneer structure fracture in the bulk solder, and the joints in board-level structure fracture at the interface of the IMC and bulk solder.

     

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