Effect of rotating electrode contact force on discharge parameters and material transfer in electric-spark deposition
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摘要: 为了研究旋转电极接触力对电火花沉积放电过程参数和材料转移的影响，进行了不同接触力下的电火花自动沉积试验. 分析了不同接触力下的各种放电波形的数量、放电脉冲的平均电压和电流等放电参数、电火花沉积的转移效率和沉积效率、沉积层的表面形貌和截面形貌、表面粗糙度等. 结果表明，接触力的变化影响了旋转电极电火花自动沉积过程中各种放电类型的数量和比例. 随着接触力的增大，接触放电比例逐渐减少而短路放电比例逐渐增加，放电脉冲的平均电压和平均功率逐渐下降而平均电流逐渐上升. 接触力对电火花沉积的转移效率和沉积效率影响较大，对表面粗糙度影响不大. 接触力为1 ~ 2 N时，自动沉积过程中的接触放电比例较高，转移效率和沉积效率也较高. 在旋转电极电火花自动沉积过程，接触放电引起的材料转移量明显高于短路放电引起的材料转移量.Abstract:In order to study the effect of rotating electrode contact force on discharge parameters and material transfer in electric-spark deposition (ESD), the automatic ESD experiments under different contact forces were carried out. The number of various discharge waveforms, discharge parameters such as average voltage and current of discharge pulses, transfer efficiency and deposition efficiency of ESD, surface morphology and cross-section morphology and surface roughness of the deposition layer under different contact forces were analyzed. The results show that the change of contact force affects the number and proportion of various discharge types during the automatic ESD process with rotating electrode. With the increase of contact force, the proportion of contact discharge decreases gradually while the proportion of short-circuit discharge increases gradually, and the average voltage and average power of discharge pulse decrease gradually while the average current increases gradually. The contact force has a great effect on the transfer efficiency and deposition efficiency of ESD, but has little influence on surface roughness. When the contact force is 1 − 2 N, the proportion of contact discharge, transfer efficiency and deposition efficiency are higher in the automatic deposition process. The amount of material transfer caused by contact discharge is significantly higher than that caused by short-circuit discharge during the automatic ESD process with rotating electrode.
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Keywords:
- electric-spark deposition /
- contact force /
- discharge waveform /
- material transfer
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图 2 电极与工件的相对位置和相对运动轨迹
Figure 2. Relative position and relative motion track of electrode and workpiece
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图 3 转移效率和沉积效率随接触力的变化曲线
Figure 3. Variation curves of transfer efficiency and deposition efficiency with contact force
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图 4 不同接触力时沉积层的表面形貌和截面形貌
Figure 4. Surface and cross-sectional morphology of deposited layer under different contact forces. (a) surface morphology of F = 0.5 N; (b) surface morphology of F = 2 N; (c) surface morphology of F = 5 N; (d) cross-sectional morphology of F = 0.5 N; (e) cross-sectional morphology of F = 2 N; (f) cross-sectional morphology of F = 5 N
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图 5 沉积层的平均厚度和表面粗糙度随接触力的变化曲线
Figure 5. Variation curves of average thickness and surface roughness of deposited layer with contact force
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图 6 放电脉冲平均电压和平均电流随接触力的变化趋势
Figure 6. Variation trend of average voltage and current of discharge pulse with contact force
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图 7 放电脉冲平均功率随接触力的变化趋势
Figure 7. Variation trend of discharge pulse average power with contact force
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图 8 工件增加量随接触放电比例的变化趋势
Figure 8. Variation trend of workpiece increment with contact discharge ratio
表 1 不同接触力下各种放电波形的数量
Table 1 Quantity of various discharge waveforms under different contact forces
接触力F/N 短路放电
数量N1/个接触放电
数量N2/个间隙放电
数量N3/个空载数量N4/个 合计放电
数量N5/个0.5 1 49 12 38 100 1 14 66 15 4 99 1.5 25 55 5 12 97 2 38 53 3 3 97 3 64 29 4 2 99 4 77 19 0 0 96 5 85 10 2 0 97 
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