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卢金斌, 贺亚勋, 张旺玺, 李华, 赵彬, 殷振, 马佳. CuSnTiNi钎料真空钎焊金刚石[J]. 焊接学报, 2017, 38(6): 125-128.
引用本文: 卢金斌, 贺亚勋, 张旺玺, 李华, 赵彬, 殷振, 马佳. CuSnTiNi钎料真空钎焊金刚石[J]. 焊接学报, 2017, 38(6): 125-128.
LU Jinbin, HE Yaxun, ZHANG Wangxi, LI Hua, ZHAO Bin, YIN Zhen, MA Jia. Analysis on vacuum brazing diamond using CuSnTiNi[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(6): 125-128.
Citation: LU Jinbin, HE Yaxun, ZHANG Wangxi, LI Hua, ZHAO Bin, YIN Zhen, MA Jia. Analysis on vacuum brazing diamond using CuSnTiNi[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(6): 125-128.

CuSnTiNi钎料真空钎焊金刚石

Analysis on vacuum brazing diamond using CuSnTiNi

  • 摘要: 采用两种不同比例CuSnTiNi混合单质金属粉,对金刚石在1 040℃保温5 min进行了真空钎焊试验.利用SEM,EDS及XRD对金刚石焊后界面微结构和钎料的微观组织进行了测试分析.结果表明,适合钎焊金刚石的活性成分为BCu70Sn15Ti10Ni5(质量分数,%),该钎料能够在钎焊时首先合金化,在金刚石表面形成了断续的TiC,实现了金刚石的高强度连接,金刚石的热损伤较小,钎料组织由α-Cu固溶体、δ-Cu31Sn8等相组成,该钎料显微硬度为130~180 HV0.1,比CuSnTi有较高的硬度.

     

    Abstract: The diamond was brazed at 1 040 ℃ for 5 min in vacuum by using two kinds of mixed metal powder with different proportion of CuSnTiNi. The microstructure of the interface and brazing alloy was analyzed by SEM, EDS and XRD. The results show that the suitable active ingredient for brazing diamond is BCu70Sn15Ti10Ni5 (mass fraction,%). The brazing alloy can be alloyed in brazing process, and there is TiC formed intermittently on the surface of the diamond, which helps realizing high strength bonding with the diamond. The thermal damage to the diamond is small. The microstructure of the brazing alloy is made up with such phase compositions as α-Cu solid solution and δ-Cu31Sn8, and the hardness of this brazing alloy is 130~180 HV0.1, which is higher than CuSnTi.

     

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