Abstract: The test which combined temperature and vibration was designed. The methods of two-parameter weibull distribution and failure analysis were applied. The effect of temperature (25 ℃ and 100 ℃) on solder interconnects subjected to vibration loading was studied. Results indicate that the temperature increase improves solder interconnects life. The solder joints at 25 ℃ and 100 ℃ always exhibit three fracture modes, interfacial crack between IMC(Intermetallic Compound)/Cu pad, crack through the bulk solder and mixed crack(both interfacial crack and crack through the bulk solder). However, the main failure mode at two temperatures is obviously different. Results indicate that the main failure mode at 25 ℃ is the crack between IMC and copper pad, while the main failure mode at 100 ℃ is the crack through the bulk solder. The failure mechanism is transformed from brittle fracture to ductile fracture with temperature rise from 25 to 100 ℃.