高级检索

基于Anand模型SnAgCu-X焊点疲劳寿命预测

孔达, 张亮, 杨帆

孔达, 张亮, 杨帆. 基于Anand模型SnAgCu-X焊点疲劳寿命预测[J]. 焊接学报, 2017, 38(4): 17-21. DOI: 10.12073/j.hjxb.20170404
引用本文: 孔达, 张亮, 杨帆. 基于Anand模型SnAgCu-X焊点疲劳寿命预测[J]. 焊接学报, 2017, 38(4): 17-21. DOI: 10.12073/j.hjxb.20170404
KONG Da, ZHANG Liang, YANG Fan. Fatigue life prediction of SnAgCu-X solder joints based on Anand model[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(4): 17-21. DOI: 10.12073/j.hjxb.20170404
Citation: KONG Da, ZHANG Liang, YANG Fan. Fatigue life prediction of SnAgCu-X solder joints based on Anand model[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(4): 17-21. DOI: 10.12073/j.hjxb.20170404

基于Anand模型SnAgCu-X焊点疲劳寿命预测

基金项目: 国家自然科学基金资助项目(51475220);新型钎焊材料与技术国家重点实验室开放课题(郑州机械研究所)(SKLABFMT-2015-03)

Fatigue life prediction of SnAgCu-X solder joints based on Anand model

  • 摘要: Anand模型采用有限元法模拟WLCSP器件Sn3.8Ag0.7Cu-X(Ce,Fe)无铅焊点在热循环载荷条件下的应力-应变响应,借助蠕变应变疲劳寿命预测模型SnAgCu,SnAgCuCe,SnAgCuFe焊点疲劳寿命.结果表明,在服役器件整体器件出现明显的变形现象,电路板翘曲严重.从中心到拐角焊点变形-应力-应变逐渐增加,芯片下拐角焊点成为整个结构潜在的危险区域.通过计算WLCSP器件SnAgCu、SnAgCuCe和SnAgCuFe三种焊点的疲劳寿命,证实了SnAgCuCe和SnAgCuFe焊点寿命明显高于SnAgCu焊点,证明了在SnAgCu中添加一定量的铈和铁可以显著提高SnAgCu焊点的使用寿命,分析结果为新型无铅钎料的研发提供理论支撑.
    Abstract: Based on Anand model, finite element method was used to analyze the stress-strain response of Sn3.8Ag0.7Cu-X(Ce,Fe) solder joints in WLCSP device, and the fatigue life of solder joints were calculated using fatigue life prediction model. The results indicated that deformation of the WLCSP device in service was found, and the significant warp of the PCB can be observed, the deformation-stress-strain in the ball array increased obviously from central solder joint to corner solder joint, the corner solder joints under the chip become the danger area of the whole device. The fatigue lives of SnAgCu, SnAgCuCe and SnAgCuFe solder joints were calculated, it was found that the fatigue life of SnAgCuCe and SnAgCuFe were higher than SnAgCu solder joints, which demonstrated in theory that the addition of Ce and Fe can improve the fatigue life of SnAgCu solder joints, which can provide the theory support for the researches of lead-free solders.
  • [1] 张 亮, Tu K N, 陈信文, 等. 近十年中国无铅钎料研究进展[J]. 中国科学: 技术科学, 2016, 46(8): 767-790. Zhang Liang, Tu K N, Chen Xinwen, et al. Development of lead-free solders in China during the past decade[J]. Scientia Sinica Technologica, 2016, 46(8): 767-790.
    [2] Zhang L, Han J G, Guo Y H, et al. Properties enhancement of SnAgCu solders containing rare earth Yb[J]. Materials and Design, 2014, 57: 646-651.
    [3] 王俭辛, 尹 明, 赖忠民, 等. Sn-Ag-Cu-In无铅钎料润湿性及显微组织[J]. 焊接学报, 2011, 32(11): 69-72. Wang Jianxin, Yin Ming, Lai Zhongmin, et al. Wettability and microstructure of Sn-Ag-Cu-In solder[J]. Transactions of the China Welding Institution, 2011, 32(11): 69-72.
    [4] 张 亮, Tu K N, 韩继光, 等. 纳米-微米颗粒增强复合钎料研究最新进展[J]. 中南大学学报(自然科学版), 2015, 46(1): 49-65. Zhang Liang, Tu K N, Han Jiguang, et al. Reviews on latest advances in micro/nano-sized particles enhanced composite solders[J]. Journal of Central South University (Science and Technology), 2015, 46(1): 49-65.
    [5] Kang S K, Lauro P, Shih D Y, et al. Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications[J]. IBM Journal of Research and Development, 2005, 49(4): 607-602.
    [6] Dudek M A, Chawla N. Effect of rare-earth (La, Ce and Y) additions on the microstructure and mechanical behavior of Sn-3.9Ag-0.7Cu solder alloy[J]. Metallurgical and Materials Transactions A, 2010, 41A: 610-620.
    [7] Hao H, Tian J, Shi Y W, et al. Properties of Sn3.8Ag0.7Cu solder alloy with trace rare earth element Y additions[J]. Journal of Electronic Materials, 2007, 36(7): 766-774.
    [8] 张 亮, 韩继光, 何成文, 等. 热循环对SnAgCu(纳米Al)/Cu焊点界面与性能影响[J]. 材料工程, 2014(3): 40-44. Zhang Liang, Han Jiguang, He Chengwen, et al. Effect of thermal cycles on the interface and property of SnAgCu (nano-Al)/Cu solder joints[J]. Journal of Materials Engineering, 2014(3): 40-44.
    [9] 张 亮, 韩继光, 郭永环, 等. 含纳米铝颗粒SnAgCu钎料组织与性能[J]. 焊接学报, 2013, 34(6): 65-68. Zhang Liang, Han Jiguang, Guo Yonghuan, et al. Microstructure and properties of SnAgCu solders bearing Al nano-particles[J]. Transactions of the China Welding Institution, 2013, 34(6): 65-68.
    [10] 张 亮, 韩继光, 郭永环, 等. WLCSP器件结构优化模拟及无铅焊点可靠性[J]. 焊接学报, 2012, 33(7): 53-56. Zhang Liang, Han Jiguang, Guo Yonghuan, et al. Optimum simulation and soldered joints reliability of WLCSP device[J]. Transactions of the China Welding Institution, 2012, 33(7): 53-56.
    [11] Zeng G, Xue S B, Zhang L, et al. Reliability evaluation of SnAgCu/SnAgCuCe solder joints based on finite element simulation and experiments[J]. Soldering & Surface Mount Technology, 2010, 22(4): 57-64.
    [12] Zhang L, Guo Y H, Sun L, et al. Reliability of SnAgCuFe solder joints in WLCSP30 device[J]. Rare Metal Materials and Engineering,2016, 45(11): 2823-2826.
    [13] Zhang L, Xue S B, Gao L L, et al. Determination of anand parameters for SnAgCuCe solder[J]. Modelling and Simulation in Materials Science and Engineering, 2009, 17(7): 075014.
    [14] Ye H, Xue S B, Zhang L, et al. Reliability evaluation of CSP soldered joints based on FEM and Taguchi method[J]. Computational Materials Science, 2010, 48(3): 509-512.
  • 期刊类型引用(19)

    1. 赵伟,金全洲. LNG动力船燃料罐疲劳强度分析. 船舶工程. 2024(03): 38-41+72 . 百度学术
    2. 林磊,汪枫,刘亮,王成军,季毅. 动车组制动控制装置结构件使用寿命预测. 智慧轨道交通. 2024(04): 7-17 . 百度学术
    3. Lufan Zhang,Boshi Jiang,Pengqi Zhang,Heng Yan,Xiangbo Xu,Ruizhuo Liu,Jingjing Tang,Caixia Ren. Methods for fatigue-life estimation: A review of the current status and future trends. Nanotechnology and Precision Engineering. 2023(02): 61-72 . 必应学术
    4. 常亚光,王瑞杰,刘国寿,王钟德,廖祥雲,赵平林. 异种铝合金氩弧焊接头的疲劳性能分析与寿命预测. 陕西科技大学学报. 2023(05): 145-151 . 百度学术
    5. 艾延廷,刘明,张凤玲,张旭,赵亚芝. 提升高温应变计寿命及精度的结构优化方法研究. 仪器仪表学报. 2022(06): 151-161 . 百度学术
    6. 庞瀛洲,张卫斌,李明,张勇,张军. 基于实测应力桥式起重机主梁疲劳寿命估算. 建筑机械. 2022(11): 111-114 . 百度学术
    7. 韩泳涛,蔺超云,曹晨阳,金守清. 离心风机叶轮强度优化设计与寿命预测. 风机技术. 2022(S1): 28-33 . 百度学术
    8. 曹蕾蕾,王严,王留涛,宋绪丁,郭城臣. 大型焊接结构疲劳寿命评估研究综述. 机械强度. 2022(06): 1443-1454 . 百度学术
    9. 刘德政,李炎,罗静,王友. T型焊接接头弯曲疲劳寿命预测方法. 塑性工程学报. 2021(01): 172-178 . 百度学术
    10. 余建星,赵岩,余杨,王华昆,王福程. 基于S-N曲线和断裂力学的浮式风力机张力腿疲劳评估. 太阳能学报. 2021(09): 250-255 . 百度学术
    11. 卢威,薛海华,万珍珍. 基于焊接结构抗疲劳设计的研究. 热处理技术与装备. 2021(05): 39-41 . 百度学术
    12. 管德清,丁湘泽,潘嫣然. 考虑残余应力影响的焊接结构疲劳总寿命预测方法. 长沙理工大学学报(自然科学版). 2020(03): 15-21 . 百度学术
    13. 成立夫,魏国前,胡珂,姜雍盛. 基于FIP的焊趾短裂纹行为仿真. 焊接学报. 2020(12): 7-12+97 . 本站查看
    14. 魏国前,周东亮,胡珂,党章. 考虑短裂纹阶段的焊接结构疲劳寿命分析. 武汉科技大学学报. 2019(02): 135-140 . 百度学术
    15. 魏国前,陈斯雯,余茜,成立夫. 焊趾多裂纹的试验与仿真分析. 焊接学报. 2019(11): 75-81+164 . 本站查看
    16. 范恒亮,李大胜. ZW型压缩机连杆的动力学与疲劳寿命分析. 廊坊师范学院学报(自然科学版). 2018(02): 41-44 . 百度学术
    17. 郑喜斌. 基于ASME标准的大轴重罐车车体疲劳寿命预测. 农业装备与车辆工程. 2018(04): 47-53 . 百度学术
    18. 申成振,栗林涛,段增旭,任欢,王健. 疲劳损伤的尿素过渡支架优化分析. 汽车实用技术. 2018(13): 71-72+82 . 百度学术
    19. 杨大鹏,潘海洋,刘邦先,张平萍,杨新华. 疲劳荷载作用下的三维弹塑性弯曲裂纹尖端张开位移. 武汉科技大学学报. 2017(05): 396-401 . 百度学术

    其他类型引用(36)

计量
  • 文章访问数:  440
  • HTML全文浏览量:  7
  • PDF下载量:  239
  • 被引次数: 55
出版历程
  • 收稿日期:  2017-04-04

目录

    /

    返回文章
    返回