Ti-Ni钎焊Cf/SiBCN陶瓷接头界面组织及机理分析
Microstructural evolution and joining mechanism of Cf/SiBCN ceramic joints brazed with Ti-Ni filler metal
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摘要: 使用Ti-Ni高温钎料实现Cf/SiBCN陶瓷自身连接.分别研究了钎料成分、钎料箔片叠层方式以及钎焊温度对焊接界面组织形貌的影响.结果表明，在Ni元素含量超过50%且以Ni/Ti/Ni方式叠层得到的接头界面良好，其中Ni元素深入陶瓷基体，与Si元素发生反应，在陶瓷内形成扩散层结构，扩散层内的Ni，Si元素成梯度分布，而Ti元素以化合物的形式弥散分布在焊缝中间部分的钎料层中试验发现，提高钎焊温度有利于Ni元素的扩散，在以Ni/Ti/Ni叠层、Ni元素含量低于50%时，提高钎焊温度至1 300℃得到的接头没有显著裂纹，中间层的钛化合物分布更加弥散.
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关键词:
- Ti-Ni高温钎料 /
- Cf/SiBCN陶瓷 /
- 界面组织 /
- 连接机理
Abstract: Cf/SiBCN ceramics have been joined using Ti-Ni high temperature filler metal. The influence of composition of solder, the laminated form of solder and the brazing temperature on the interfacial microstructure have been studied. It has been found that a good interface can be obtained when the content of Ni was over 50% and the laminated form was Ni/Ti/Ni. The Ni element diffused into the ceramic substrate and reacted with Si element, a diffusion layer has been formed in the ceramic, thus a gradient distribution of Ni, Si element within the diffusion layer was obtained, while Ti element dispersed in the middle of the filler layer in the form of compound. The experimental results revealed that increasing the brazing temperature is beneficial to the diffusion of Ni element. When the laminated form of solder was Ni/Ti/Ni, the content of Ni was lower than 50%, and the brazing temperature was increased to 1 300 ℃, a joint without significant crack can be obtained, and the distribution of Ti compound in the middle layer was more dispersed. -
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