Y2O3/Sn-58Bi复合钎料制备及其性能分析
Preparation and properties of Y2O3/Sn-58Bi composite solders
-
摘要: 文中通过粉末冶金法制备了Y2O3/Sn-58Bi复合钎料.结果表明,添加少量Y2O3,对复合钎料熔点影响较小;随着Y2O3质量分数提高,复合钎料的密度和显微维氏硬度先升高后降低;复合钎料的润湿角表现出相反的趋势,随着Y2O3质量分数提高,复合钎料的润湿角先降低后升高.通过测试Sn-58Bi钎料和0.1%(质量分数)Y2O3/Sn-58Bi复合钎料拉伸试样的力学性能发现,添加质量分数为0.1%的Y2O3对复合钎料强度稍有提高,但能明显提高复合钎料的延展性,从而解决传统Sn-58Bi钎料较脆的难题.通过观察钎料拉伸断口发现,添加Y2O3能够细化复合钎料微观组织,使裂纹沿着断裂方向扩展时受到阻碍,抑制了钎料脆性断裂的趋势.Abstract: In the present work, the Y2O3/Sn-58Bi composite solders have been prepared by powder metallurgy method. The melting point of the solder was slightly affected by the addition of few amount of Y2O3. With the increase of the amount of Y2O3, the density and vickers microhardness were firstly increased to the peak value and then decreased with further addition of Y2O3, while the contact angle demonstrated the converse tendency. Compared with Sn-58Bi solder, the strength of the composite solder was slightly increased while the ductility was significantly improved after the addition of 0.1 wt.% Y2O3, solving the brittle problems of the traditional Sn-58Bi solder. Further observation of the fracture surface indicated that the addition of Y2O3 could refine the grain size of the Sn-58Bi and inhabits the propagation of cracks, which improve the ductility of the Sn-58Bi.
-
Keywords:
- Yttrium oxide /
- composite solder /
- microstructure /
- mechanical properties
-
-
[1] Yang L, Dai J, Zhang Y, et al. Influence of BaTiO3 nanoparticle addition on microstructure and mechanical properties of Sn-58Bi solder[J]. Journal of Electronic Materials, 2015, 44(7):2473-2478. [2] Zhang C, Liu S, Qian G, et al. Effect of Sb content on properties of Sn-Bi solders[J]. Transactions of Nonferrous Metals Society of China, 2014, 24(1):184-191. [3] 马秀玲. SnAgCu系无铅钎料的研究[D]. 北京:北京工业大学, 2004. [4] 胡丽, 曾明, 沈保罗. Sn-Bi无铅焊料的研究[J]. 现代电子技术, 2009, 32(16):164-166. Hu Li, Zeng Ming, Shen Baoluo. Study on Sn-Bi Lead-free Solder[J]. Modern Electronic Technology,2009, 32(16):164-166. [5] Sigelko J D, Subramanian K N. Overview of lead-free solders[J]. Advanced Materials & Processes, 2000, 157(3):47-48. [6] 徐骏, 胡强, 林刚, 等. Sn-Bi系列低温无铅焊料及其发展趋势[J]. 电子工艺技术, 2009, 30(1):1-4. Xu Jun, Hu Qiang, Lin Gang, et al. Sn-Bi series of low-temperature lead-free solder and development trend[J]. Electronic Process Technology, 2009, 30(1):1-4. [7] 陆凤姣. Sn-58Bi复合钎料的制备及性能研究[D]. 哈尔滨:哈尔滨工业大学, 2011. [8] Lin D, Wang G X, Srivatsan T S, et al. The influence of copper nanopowders on microstructure and hardness of lead-tin solder[J]. Materials Letters, 2002, 53(1):333-338.
计量
- 文章访问数: 628
- HTML全文浏览量: 10
- PDF下载量: 529