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基于田口法的高密度倒装微铜柱凸点热失效分析

任宁, 田野, 蔡刚毅, 尚拴军, 吴丰顺

任宁, 田野, 蔡刚毅, 尚拴军, 吴丰顺. 基于田口法的高密度倒装微铜柱凸点热失效分析[J]. 焊接学报, 2017, 38(1): 35-38.
引用本文: 任宁, 田野, 蔡刚毅, 尚拴军, 吴丰顺. 基于田口法的高密度倒装微铜柱凸点热失效分析[J]. 焊接学报, 2017, 38(1): 35-38.
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REN Ning, TIAN Ye, CAI Gangyi, SHANG Shuanjun, WU Fengshun. Thermal failure analysis of micro copper pillar bumps for high density flip chip packaging based on Taguchi method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(1): 35-38.
Citation: REN Ning, TIAN Ye, CAI Gangyi, SHANG Shuanjun, WU Fengshun. Thermal failure analysis of micro copper pillar bumps for high density flip chip packaging based on Taguchi method[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2017, 38(1): 35-38.
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基于田口法的高密度倒装微铜柱凸点热失效分析

  • 1.

    河南工业大学 机电工程学院, 郑州 450001;华中科技大学 武汉光电国家实验室, 武汉 430074

  • 2.

    河南工业大学 机电工程学院, 郑州 450001

  • 3.

    华中科技大学 武汉光电国家实验室, 武汉 430074

基金项目: 国家自然科学基金资助项目（U1504507）；河南省科技攻关资助项目（162102410018）；河南省高等学校重点科研项目计划（17H130004）

Thermal failure analysis of micro copper pillar bumps for high density flip chip packaging based on Taguchi method

  • 1.

    School of Mechanic & Electrical Engineering, Henan University of Technology, Zhengzhou 450001, China;Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China

  • 2.

    School of Mechanic & Electrical Engineering, Henan University of Technology, Zhengzhou 450001, China

  • 3.

    Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China

摘要

    摘要
  • 摘要: 采用有限元模拟法，分析在热循环载荷条件下高密度倒装芯片封装微铜柱凸点的失效行为，并以微铜柱凸点的最大累积塑性应变能密度作为响应，采用3因素3水平的田口正交试验法分析倒装芯片封装的主要结构参数和材料属性对其热失效行为的影响.结果表明，距离封装中心最远处的微铜柱凸点是封装体中的关键微凸点，热疲劳导致的裂纹易在该微铜柱凸点的基板侧焊料外侧形成.底部填充胶的线膨胀系数对微铜柱凸点热失效的影响最大，影响适中的是底部填充胶的弹性模量，最弱的是芯片厚度.
    Abstract: The finite element method was used to study the failure behavior of the micro copper pillar bumps under the thermal cycle, and in order to simulate the influence of the main structure parameters and material properties on the cumulative plastic strain energy density,the Taguchi orthogonal experiment with three factors and three levels was designed by using the maximum cumulative plastic strain energy density of the micro copper pillar bumps as the response.The results showed that:micro copper pillar bumps corresponding to the most distant distance from the symmetrical center of the packaging was the key micro copper pillar bumps, and the crack were liable to form at the interface of solder and substrate for the key micro copper pillar bumps. The linear expansion coefficient of the underfill played the most important role but the chip thickness played the least important role in affecting the thermal failure of the micro copper pillar bumps.
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    • 参考文献(9)
  • [1] Chen K M, Wu C Y, Wang C H, et al. An RDL UBM structural design for solving ultra low-k, delamination problem of Cu pillar bump flip chip BGA packaging[J]. Journal of Electronic Materials, 2014, 43(11):4229-4240.
    [2] Jhou J R, Tsai M Y, Wu C Y, et al. Thermal stresses and deformations of Cu pillar flip chip BGA package:Analyses and measurements[C]//Microsystems Packaging Assembly and Circuits Technology Conference. IEEE, Taipei, 2010:1-4.
    [3] Tunga K, Sitaraman S K. Predictivemodel development for life prediction of PBGA packages with SnAgCu solder joints[J]. IEEE Transactions on Components & Packaging Technologies, 2010, 33(1):84-97.
    [4] Kim J W, Kim D G, Hong W S, et al. Evaluation of solder joint reliability in flip-chip packages during accelerated testing[J]. Journal of Electronic Materials, 2005, 34(12):1550-1557.
    [5] Lau J, Dauksher W. Reliability of an 1657CCGA (ceramic column grid array) package with 95.5SN3.9AG0.6CU lead-rree solder paste on PCBs (printed circuit boards)[J]. Journal of Electronic Packaging, 2003, 127(2):229-238.
    [6] 盛重, 薛松柏, 张亮, 等. 引线间距对QFP焊点的可靠性影响的有限元分析[J]. 焊接学报, 2008, 29(5):85-88. Sheng Zhong, Xue Songbai, Zhang Liang, et al. Finite element analysis on the influence of lead spacing on QFP solder joints reliability[J]. Transactions of the China Welding Institution, 2008, 29(5):85-88.
    [7] 田野, 任宁. 热冲击条件下倒装组装微焊点的可靠性-寿命预测[J]. 焊接学报, 2016, 37(2):51-54. Tian Ye, Ren Ning. Prediction of reliability of solder joint for fine pitch flip chip assemblies under thermal shock[J]. Transactions of the China Welding Institution, 2016, 37(2):51-54.
    [8] 韦何耕, 黄春跃, 梁颖, 等. 热循环加载条件下PBGA叠层无铅焊点可靠性分析[J]. 焊接学报, 2013, 34(10):91-94. Wei Hegeng, Huang Chunyue, Liang Ying, et al. Reliability analysis of plastic ball grid array double-bump lead-free solder joint under thermal cycle[J]. Transactions of the China Welding Institution, 2013, 34(10):91-94.
    [9] Hsieh M C, Lee C C, Li C H. Reliability assessments and designs for fine pitch flip chip packages with Cu column bumps[C]//Microsystems, Packaging, Assembly and Circuits Technology Conference. IEEE,Taipei, 2012:280-283.
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出版历程
  • 收稿日期:  2015-09-04

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