基于热-结构耦合的叠层金凸点应力分析

邵良滨; 黄春跃; 梁颖; 周兴金; 赖宇阳

基于热-结构耦合的叠层金凸点应力分析

1.
桂林电子科技大学机电工程学院, 桂林 541004
2.
成都航空职业技术学院电子工程系, 成都 610021
3.
树优信息技术有限公司, 北京 100062

基金项目: 国家自然科学基金资助项目（51465012）；广西壮族自治区自然科学基金资助项目（2012GXNSFAA053234、2013GXNS-FAA019322）；四川省教育厅科研资助项目（13ZB0052）

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- 收稿日期: 2014-12-25

Study on stacked AU bumps stress based on thermal-structure coupling

1.
School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
2.
Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu 610021, China
3.
SOYOTEC LIMITED, Beijing 100062, China

摘要

摘要: 建立了叠层金凸点三维有限元分析模型，通过Isight软件对该模型进行了热-结构耦合分析，获取了热-结构耦合条件下叠层金凸点等效应力的分布规律，分析了叠层金凸点结构尺寸变化对应力的影响，通过方差分析获得了下层凸点直径、下层凸点高度、上层凸点直径、上层凸点高度因素对应力影响的显著性.结果表明，最大应力点都出现于远端角落处的凸点，随着凸点高度的增加，最大应力值逐渐减小.在置信度为90%的情况下，下层凸点直径对应力有显著影响，因素显著性排序为，下层凸点直径最大，其次为上层凸点直径，再次为下层凸点高度，最后是上层凸点高度.
- 叠层金凸点 /
- 等效应力 /
- 热-结构耦合分析 /
- 有限元分析 /
- 方差分析
Abstract: The 3D finite element analysis models of stacked AU bumps were developed, by using Isight software. The thermal-structure coupling analysis of the model was performed, the equivalent stress distribution of stacked AU bumps was obtained under the condition of thermal-structure coupling. The influence of the changes in stacked AU bumps structure on stress was studied. The influence significance of the below bump diameter, the below bump height, the above bump diameter, the above bump height on stress were obtained by variance analysis. The results of study show, the maximum stresses appear in the outer bump; With the increase of the bump height the highest stresses decrease gradually, with 99% confidence, the below bump diameter have highly significant impact on the stress, the below bump diameter, the above bump diameter, the below bump height, the above bump height affect the stress in a descending order.
- stacked AU bumps /
- equivalent stress /
- thermal-structure coupling analysis /
- finite element analysis /
- variance analysis

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参考文献(13)

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文章访问数: 514
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基于热-结构耦合的叠层金凸点应力分析

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出版历程

Study on stacked AU bumps stress based on thermal-structure coupling

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