高级检索

CBGA器件温度场分布对焊点疲劳寿命影响的有限元分析

王尚, 田艳红, 韩春, 刘洋志

王尚, 田艳红, 韩春, 刘洋志. CBGA器件温度场分布对焊点疲劳寿命影响的有限元分析[J]. 焊接学报, 2016, 37(11): 113-118.
引用本文: 王尚, 田艳红, 韩春, 刘洋志. CBGA器件温度场分布对焊点疲劳寿命影响的有限元分析[J]. 焊接学报, 2016, 37(11): 113-118.
shu
WANG Shang, TIAN Yanhong, HAN Chun, LIU YangZhi. Effect of temperature distribution of CBGA components on fatigue life of solder joint by FEA[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(11): 113-118.
Citation: WANG Shang, TIAN Yanhong, HAN Chun, LIU YangZhi. Effect of temperature distribution of CBGA components on fatigue life of solder joint by FEA[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(11): 113-118.
shu

CBGA器件温度场分布对焊点疲劳寿命影响的有限元分析

  • 1.

    哈尔滨工业大学 先进焊接与连接国家重点实验室, 哈尔滨 150001

  • 2.

    中国电子科技集团公司第二十九研究所, 成都 610036

基金项目: 上海航天科技创新基金资助项目（SAST201465）

Effect of temperature distribution of CBGA components on fatigue life of solder joint by FEA

  • 1.

    State Key Laboratory, of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

  • 2.

    The 29 th Research Institute of China Electronics Technology Group Corporation, Chengdu 610036, China

摘要

    摘要
  • 摘要: 陶瓷封装器件的可靠性一直是电子封装领域关注的热点，目前有限元模拟方法在分析焊点疲劳寿命时大多采用了均一温度假设条件，而陶瓷封装器件由于自身材料性质，在热循环载荷下其内部温度场并不均匀.文中在传统经典理论的基础上利用ANSYS有限元软件采用六面体网格划分技术对16×16阵列的陶瓷球栅阵列（ceramic ball grid array，CBGA）封装模型在热循环载荷下的可靠性进行了仿真分析.考虑了热循环加载过程中CBGA器件内部的温度场分布，使用热力耦合模型讨论了均一温度假设在不同条件下的合理性.结果表明，考虑温度场分布的情况下预测的疲劳寿命要低于均一温度假设条件，为温度均一假设适用条件提供了判断依据.
    Abstract: The reliability of ceramic package devices have always been the attractive topic of electronic package. Many previous researches used a uniform temperature assumption to study the fatigue life of solder joint under thermal cycle through the finite element analysis method. But the internal temperature field of ceramic packing is not uniform in fact, because of its special nature of the material. In this paper, by using the ANSYS finite element software, the reliability of the 16×16 ceramic ball grid array (ceramic ball grid array, CBGA) package model under thermal cycle load was carried out based on the classical theory using hexahedral grid. Considering the internal temperature field distribution of the CBGA components under thermal cycle load, the rationality of the uniform temperature assumption under different conditions are discussed. And the simulation results show that the predict fatigue life under the condition of non-uniform temperature distribution is lower than the one with uniform temperature assumption conditions. Through the above discussion, the judgment can be provided for the usage of uniform temperature hypothesis.
    • HTML全文
    • 参考文献(15)
  • [1] 田艳红, 王宁, 杨东升, 等. 三维封装芯片键合IMC焊点应力分析及结构优化[J]. 焊接学报, 2012, 33(8):17-20. Tian Yanhong, Wang Ning, Yang Dongsheng, et al. Stress analysis and structure optimization of IMC joints in 3D package[J]. Transactions of the China Welding Institution, 2012, 33(8):17-20.
    [2] Yang L, Bernstein J B, Koschmieder T. Assessment of acceleration models used for BGA solder joint Reliability studies[J]. Microelectronics reliability, 2009, 49(12):1546-1554.
    [3] Vandevelde B, Degryse D, Beyne E, et al. Modified micro-thermomechanical modelling of ceramic ball grid array packages[J]. Microelectronics Reliability, 2003, 43(2):307-318.
    [4] Biswas K, Liu S, Zhang X, et al. The 1st level & 2nd level solder joint reliability Co-design for larger die flip chip package[C]//Electronics Packaging Technology Conference, 2007. EPTC 2007. 9th. IEEE, 2007:32-36.
    [5] Yeo A, Lee C, Pang J H L. Flip chip solder joint reliability analysis using viscoplastic and elastic-plastic-creep constitutive models[J]. Components and Packaging Technologies, IEEE Transactions, 2006, 29(2):355-363.
    [6] Ghaffarian, R. Accelerated thermal cycling and failure mechan-isms for BGA and CSP assemblies[J]. Journal of Electronic Packaging, 2000, 122(4):335-340.
    [7] 李杨. 混合组装BGA焊点可靠性模拟与试验[D]. 哈尔滨:哈尔滨工业大学, 2013.
    [8] Standard J. Temperature cycling[S]. JESD22-A104D, JEDEC Solid State Technology Association, Arlington, VA, 2009.
    [9] 田艳红, 贺晓斌, 杭春进. 残余应力对混合组装BGA热循环可靠性影晌[J]. 机械工程学报, 2014, 50(2):86-91. Tian Yanhong, He Xiaobin, Hang Chunjin. Influence of the hybrid BGA residual stress after reflow on the thermal cycling reliability[J]. Journal of Mechanical Engineering, 2014, 50(2):86-91.
    [10] 周文凡, 田艳红, 王春青. BGA焊点的形态预测及可靠性优化设计[J]. 电子工艺技术, 2005, 26(4):187-191. Zhou Wenfan, Tian Yanhong, Wang Chunqing. Shape prediction of BGA solder joint and its reliability optimization design[J]. Electronics Process Technology, 2005, 26(4):187-191.
    [11] Ting-biao J, Chao D, Long-hui X. Finite element analysis and fatigue life prediction of BGA mixed solder joints[C]//High Density packaging and Microsystem Integration, 2007. HDP'07. International Symposium on. IEEE, 2007:1-6.
    [12] 薛明阳. BGA封装的可靠性模拟与实验验证[D]. 广州:华南理工大学, 2013.
    [13] 张亮, 薛松柏, 卢方焱, 等. 不同钎料对QFP焊点可靠性影响的有限元分析[J]. 焊接学报, 2007, 28(10):45-48. Zhang Liang, Xue Songbai, Lu Fangyan, et al. Finite element analysis on soldered joint reliability of QFP device with different solders[J]. Transactions of the China Welding Institution, 2007, 28(10):45-48.
    [14] Zhang L, Han J, He C, et al. Reliability behavior of lead-free solder joints in electronic components[J]. Journal of Materials Science:Materials in Electronics, 2013, 24(1):172-190.
    [15] Ghaffarian R. CCGA packages for space applications[J]. Micro-electronics Reliability, 2006, 46(12):2006-2024.
    • 相关文章
    • 施引文献
    • 资源附件(0)
计量
  • 文章访问数:  504
  • HTML全文浏览量:  4
  • PDF下载量:  429
  • 被引次数: 0
出版历程
  • 收稿日期:  2015-01-20

目录

摘要
HTML全文
    参考文献(15)
    相关文章
    施引文献
    资源附件(0)

    /

    返回文章
    返回

    网站版权 © 焊接杂志社焊接学报编辑部电话：0451-86323218地址：哈尔滨市松北区创新路2077号

    本系统由 北京仁和汇智信息技术有限公司 开发  百度统计