[1] |
武高辉, 修子扬, 孙东立, 等. 环保型电子封装用SiCp/Al复合材料性能研究[J]. 材料科学与工艺, 2006, 3(14): 244-246. Wu Gaohui, Xiu Ziyang, Sun dongli, et al. Study on properties of the environmental-friendly SiCP/Al composites for electronic packaging applications[J]. Materials Science & Technology, 2006, 3(14): 224-246.
|
[2] |
Huang R Y, Chen S C, Huang J C. Electron and laser beam welding of high strain rate super plastic Al-6061/SiC Composites[J]. Metallurgical and Materials Transactions A, 2001, 32(10): 2575-2584.
|
[3] |
Chen M A, Wu C S, Zou Z D. Electron Beam Welding of SiCP/LD2 composites[J]. Transactions of Nonferrous Metals Society of China, 2006, 16(4): 818-823.
|
[4] |
雷玉成, 王志伟, 陈希章, 等. 电弧超声对SiC_p/Al MMCs焊缝组织与性能的影响[J]. 焊接学报, 2010, 31(10): 17-21. Lei Yucheng, Wang Zhiwei, Chen Xizhang, et al. Investments on influences of the arc ultrasonic on the microstructure and performance of SiCp/Al MMCs joints[J]. Transactions of the China Welding Institution, 2010, 31(10): 17-21.
|
[5] |
陈铮, 金朝阳, 顾晓波, 等. 用Cu箔中间层瞬间液相连接SiC_P/Al复合材料的界面现象与连接强度[J]. 焊接学报, 2001, 22(5): 27-30. Chen Zheng, Jin Chaoyang, Gu Xiaobo, et al. Interfacial Phenomena and Joint strength in transient liquid-phase bonding of SiCP/Al metal matrix composite using cu foil interlayer[J]. Transactions of the China Welding Institution, 2001, 22(5): 27-30.
|
[6] |
Kavian O C, Tahir I K, Gossett D, et al. Transient liquid phase diffusion bonding Al-6061 using nano-dispersed ni coatings[J]. Materials and Design, 2012, 7(33): 469-475.
|
[7] |
张洋, 闫久春. 高体积分数SiC颗粒增强铝基复合材料的超声波钎焊[J]. 焊接, 2008(8): 29-31. Zhang Yang, Yan Jiuchun. Ultrasonic brazing of SiC particles reinforced aluminum matrix composite with a high fraction volume[J]. Welding & Joining, 2008(8): 29-31.
|
[8] |
Ellis M, Gittos M, Threadgill P L. Joining of aluminum base metal matrix composites[J]. International Materials Reviews, 1996(2): 41-58.
|
[9] |
南水平, 黄继华, 陈树海, 等. Al-Si-Cu合金粉末扩散钎焊Al/Cu接头组织及性能[J]. 焊接学报, 2014, 35(1): 79-82. Nan Shuiping, Huang Jihua, Chen Shuhai, et al. Microstructure and properties of diffusion brazed aluminum/copper joint with Al-Si-Cu alloy powder[J]. Transactions of the China Welding Institution, 2014, 31(1): 79-82.
|