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扩散焊接头缺陷超声C扫描检测能力分析

Analysis of ultrasonic C-scan detectability on diffusion bonding joint

  • 摘要: 扩散焊界面缺陷的检测是目前无损检测领域的难点之一. 为研究超声C扫描对钛合金扩散焊接头小缺陷的检测能力,以钛合金为研究对象,制作了含有不同尺寸和类型缺陷的扩散焊试件,研究了步进长度和检测频率对检测能力的影响,最后通过破坏性测试结果对其进行验证. 结果表明,使用较小的步进长度和较高的检测频率,可提高检测的准确度,但扩散焊界面存在大量接触型和微小型缺陷,因此采用超声法难以对其进行精确定量.

     

    Abstract: The detection of defect on the diffusion bond interface is one of the difficulties in nondestructive testing. In order to investigate the detectability of ultrasonic C-scan on titanium alloy diffusion bonding joint, by taking titanium alloy as the research object, diffusion bond samples with different size and type defects were manufactured, and the influence of scan step and detection frequency on the detectability was studied, then it was verified with destructive testing results. The results demonstrated that the detection accuracy can be improved by using smaller step size and higher detection frequency. However, there is a great deal of contact-type and micro defects on the bonding interface, thus it is difficult to precisely quantify it with common ultrasonic testing.

     

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