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外加载荷对镀锡层锡须生长行为的影响

姚宗湘, 罗键, 尹立孟, 王刚, 张丽萍

姚宗湘, 罗键, 尹立孟, 王刚, 张丽萍. 外加载荷对镀锡层锡须生长行为的影响[J]. 焊接学报, 2016, 37(7): 27-30.
引用本文: 姚宗湘, 罗键, 尹立孟, 王刚, 张丽萍. 外加载荷对镀锡层锡须生长行为的影响[J]. 焊接学报, 2016, 37(7): 27-30.
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YAO Zongxiang, LUO Jian, YIN Limeng, WANG Gang, ZHANG Liping. Effect of external loading on the growth behavior of tin whisker on tin coating[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(7): 27-30.
Citation: YAO Zongxiang, LUO Jian, YIN Limeng, WANG Gang, ZHANG Liping. Effect of external loading on the growth behavior of tin whisker on tin coating[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(7): 27-30.
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外加载荷对镀锡层锡须生长行为的影响

  • 1.

    重庆大学 机械传动国家重点实验室, 重庆 400030;重庆科技学院 冶金与材料工程学院, 重庆 401331

  • 2.

    重庆大学 机械传动国家重点实验室, 重庆 400030

  • 3.

    重庆科技学院 冶金与材料工程学院, 重庆 401331;哈尔滨工业大学 现代焊接生产技术国家重点实验室, 哈尔滨 150001

  • 4.

    重庆科技学院 冶金与材料工程学院, 重庆 401331

基金项目: 重庆市前沿与应用基础研究项目（cstc2014jcyjA40009）；重庆市教委科学技术研究项目（KJ131415）；重庆科技学院校内科研基金（CK2013Z12）；先进焊接与连接国家重点实验室开放课题研究基金资助项目（AWJ-M15-05）

Effect of external loading on the growth behavior of tin whisker on tin coating

  • 1.

    The State Key Laboratory of Mechanical Transmission, Chongqing University, Chongqing 400030, China;School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China

  • 2.

    The State Key Laboratory of Mechanical Transmission, Chongqing University, Chongqing 400030, China

  • 3.

    School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China;State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

  • 4.

    School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China

摘要

    摘要
  • 摘要: 首先研究了三种不同厚度镀锡层（3，5，13 μm）在相同试验条件（70℃时效24 h后室温放置60天）下的锡须生长情况，并在此基础上首次采用精密动态力学分析仪（DMA Q800）研究了精确控制相同载荷条件下拉、压两种外力对相同厚度镀锡层（3 μm）锡须生长行为的影响.结果表明，相同时效条件下，镀锡层越薄，锡须生长的可能性越大；相同的外加载荷和试验温度作用下，承受压力作用镀锡层，其表面锡须生长比承受拉力时生长更快，并且主要呈柱状生长.
    Abstract: The growth behavior of tin whisker on tin coating with thicknesses of 3 μm, 5 μm and 13 μm was investigated after thermal aged at 70℃ for 24 hours and then placed at room temperature for 60 days. The tin coating with thickness of 3 μm was selected to perform the external loading experiments with Dynamic Mechanical Analyzer (DMA Q800, TA-Instruments). The experimental results show that the tin whisker grew much easier on thinner coating than on thicker one under the same thermal aging condition. Moreover, external compressive load led to much more and faster tin whiskers growth on thin coating with thickness 3 μm, compared to tensile load.
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    • 参考文献(10)
  • [1] 张新平,尹立孟,于传宝.电子和光子封装无铅钎料的研究和应用进展[J].材料研究学报,2008,22(1):1-9.Zhang Xinping,Yin Limeng,Yu Chuanbao.Advances in research and application of lead-free solders for electronic and photonic packaging[J].Chinese Journal of Materials Research,2008,22(1):1-9.
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    [8] Moriuchi H,Tadokoro Y,Sato M,et al.Microstructure of external stress whiskers and mechanical indentation test method[J].Journal of Electronic Materials,2007,36(3):220-225.
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    [10] Vianco P T,Rejent J A.Dynamic recrystallization (DRX) as the mechanism for Sn whisker development.part Ⅱ:experimental study[J].Journal of Electronic Materials,2009,38(9):1826-1837.
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  • 收稿日期:  2014-08-19

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