Sn-9Zn/Cu无铅焊点ZnO须自发生长

张亮; 杨帆; 郭永环; 钟素娟; 马佳; 鲍丽

Sn-9Zn/Cu无铅焊点ZnO须自发生长

1.
江苏师范大学机电工程学院, 徐州 221116
2.
郑州机械研究所新型钎焊材料与技术国家重点实验室, 郑州 450001

基金项目: 国家自然科学基金项目（51475220）；新型钎焊材料与技术国家重点实验室开放课题（SKLABFMT-2015-03）

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出版历程
- 收稿日期: 2015-12-28

Spontaneous growth of ZnO whiskers in Sn-9Zn/Cu lead-free solder joints

1.
School of Mechanical & Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China
2.
State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China

摘要

摘要: 研究了Sn-9Zn/Cu无铅焊点ZnO须自发生长行为.结果表明，在室温条件下Sn-9Zn/Cu无铅焊点因为富锌相的氧化，在富锌相表面自发生长出大量的ZnO须，ZnO须呈现针状、块状、花朵状等不同形态；对ZnO须进行FIB测试，发现在富锌相中出现明显的空洞，主要是因为Zn元素扩散导致的.另外，证实在Zn元素扩散与氧发生反应的过程中，富锌相发生体积收缩，诱使结构中出现明显的拉应力，拉应力为ZnO须生长提供驱动力.
- 无铅焊点 /
- 富锌相 /
- ZnO须 /
- 拉应力
Abstract: Spontaneous growth of ZnO whiskers in Sn-9Zn/Cu lead-free solder joints was investigated. The results indicate that due to the oxidation of rich-Zn phases at room temperature, ZnO whisker will spontaneously grow on the surface of Zn-rich phase in Sn-9Zn/Cu lead-free solder joints, and these whiskers showed different morphologies like needle-type, bulk-type and flower-type, etc. Based on FIB test of ZnO whisker, it was found that voids appeared in the Zn-rich phase, which was induced by the diffusion of Zn atoms. In addition, during reaction between Zn and O, volume shrinkage of Zn-rich phase might happen, and the tensile stress could be generated in the structure which was the driving force of ZnO whisker growth.
- lead-free solder joints /
- rich-Zn phases /
- ZnO whiskers /
- tensile stress

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参考文献(15)

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