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镀银铜箔平行微隙电阻焊接头组织与性能

Microstructure and mechanical properties of parallel micro gap welds in silver-gilt copper foil and copper foil

  • 摘要: 研究了0.1 mm厚镀银铜箔与纯铜箔平行微隙电阻焊接头的微观组织和力学性能,分析了不同参数对接头力学性能的影响,利用扫描电子显微镜对典型接头界面处的微观组织特征进行了分析. 结果表明,焊点连接面处组织致密;连接面由富银相和富铜相组成的两相区和只有富铜相的单相区组成,焊接温度达到了银的熔点,其连接机理与钎焊类似;试验所用参数范围内,焊点的最大剪切抗力达到了59 N,焊接功率和焊接时间对焊点性能的影响较大,而电极压力的影响较小.

     

    Abstract: Silver-gilt copper foil and copper foil in thiclcnese of 0.1 mm were welded with parallel micro gap welding, in which the influence of different parameters on the mechanical properties was studied, microstructure of the typical joint were tested by SEM. The experimental results indicated that sound joints were made, and the interface consisted of two phase region which includes Cu-rich region and Ag-rich region and single phase region which includes only Cu-rich region; welding temperature reaches the melting point of silver, the welding mechanism is similar to brazing; in the range of parameters used, the shear strength of the joints reached 59N, welding power and welding time had obvious influence to the mechanical property of the joint, and electrode force had inconspicuous influence to the mechanical property of the joint.

     

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