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彭迟, 程东海, 陈益平, 胡德安. 铝/铜异种材料等离子弧熔钎焊搭接接头工艺分析[J]. 焊接学报, 2016, 37(4): 65-68.
引用本文: 彭迟, 程东海, 陈益平, 胡德安. 铝/铜异种材料等离子弧熔钎焊搭接接头工艺分析[J]. 焊接学报, 2016, 37(4): 65-68.
PENG Chi, CHENG Donghai, CHEN Yiping, HU Dean. Analysis process of plasma arc melting brazing lap joint of dissimilar materials of aluminum and copper[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(4): 65-68.
Citation: PENG Chi, CHENG Donghai, CHEN Yiping, HU Dean. Analysis process of plasma arc melting brazing lap joint of dissimilar materials of aluminum and copper[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(4): 65-68.

铝/铜异种材料等离子弧熔钎焊搭接接头工艺分析

Analysis process of plasma arc melting brazing lap joint of dissimilar materials of aluminum and copper

  • 摘要: 采用LHM-200等离子弧焊机和Zn-Al钎料对T2紫铜与LF6防锈铝异种材料进行了等离子弧熔钎焊,通过扫描电镜(SEM)和能谱分析仪(EDS)观察分析其接头显微组织和界面元素组成.结果表明,通过合理设置工艺可以得到较为理想的焊接接头,焊缝表面无裂纹、气孔等现象,搭接接头抗剪强度可达175.5 MPa;控制等离子弧焊工艺可以有效控制钎缝成形,提高接头性能,最佳参数范围为等离子气体的流量0.2,0.75 L/min,焊接电流45~55 A,焊接速度1.41~3.03 cm/s;在铜母材与钎料界面处是Al2Cu和CuZn2金属间化合物层;而在铝母材与钎料界面处为Al-Zn共晶组织;焊缝中心的是黑白相间的条纹组织,黑区为富铝区,白区为富锌区.

     

    Abstract: LHM-200 plasma arc welding machine and the Zn-Al solder were used to melting braze dissimilar materials of T2 copper and LF6 rust-proof aluminum, the microstructure in the joint and the elementary composition in the interfacial are studied by using scanning electron microscope and energy spectrum analysis respectively. The results showed that, the technological parameters of welding process have a significant impact on the weld shape and joint mechanical properties. A reasonable process can obtain a satisfactory welded joints. The lap joint tensile shear strength was up to 175.5 MPa. Controlled plasma arc welding process can effectively control the brazing seam forming,and improve the joint performance. The best range of parameters for the welding current was 45~55 A, welding speed was 1.41~3.03 cm/s and plasma gas/protective gas flow rate was 0.2/0.75 L/min. The intermetallic compounds in the interface of copper and solder primarily are Al2Cu and CuZn2, and that in the interface of aluminum and solder is Al-Zn eutectic. In the middle of the solder is the black and white stripes organization, the black is Al-rich area, the white is Zn-rich area.

     

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