复合添加Ga/Nd对超低银SAC钎料组织和性能的影响

Effect of Ga/Nd composite additive on the wettability and microstructure of low silver Sn-Ag-Cu solder

摘要: 研究了复合添加Ga/Nd对超低银Sn-0.3Ag-0.7Cu钎料组织和性能的影响.结果表明,复合添加微量Ga/Nd元素(0.025~1%)可以显著改善钎料的润湿性能,当Nd元素的添加量为0.1%时钎料的润湿时间最短,润湿力,此时钎料在250℃时的润湿时间已达到了波峰焊的应用标准.添加适量Ga/Nd元素后钎料组织得到了明显细化,当Nd元素的添加量为0.1%时钎料组织最为细小均匀,同时焊点抗剪力相比母合金提升了约15%.当添加过量稀土元素后,结果表明,在钎料组织中并未发现明显的稀土相,说明Ga/Nd复合添加对稀土相的生成起到了一定的抑制作用.

Abstract: The effect of Ga/Nd composite additive on the wettability and microstructure of n-0.3Ag-0.7Cu solder were investigated.The results indicated that the composite additive of Ga and Nd could greatly improve the wettability of solder, the optimal wettability of solder was obtained when the addition of Nd reached 0.1 wt.%. After adding moderate amount of Ga and Nd, the microstructure of solder was refined andthe shear strength of soldered joint was improved by 15%. Compared with the previous results that excessive amount of Nd was added, no obviously Sn-Nd phase observed in the solder, indicating that the composite additive of Ga and Nd could inhibit the formation of Sn-Nd phase to a certain extent.