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复合添加Ga/Nd对超低银SAC钎料组织和性能的影响

薛鹏, 周琦, 王克鸿, 张德库, 何鹏, 龙伟民, 钟素娟

薛鹏, 周琦, 王克鸿, 张德库, 何鹏, 龙伟民, 钟素娟. 复合添加Ga/Nd对超低银SAC钎料组织和性能的影响[J]. 焊接学报, 2016, 37(3): 33-36.
引用本文: 薛鹏, 周琦, 王克鸿, 张德库, 何鹏, 龙伟民, 钟素娟. 复合添加Ga/Nd对超低银SAC钎料组织和性能的影响[J]. 焊接学报, 2016, 37(3): 33-36.
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XUE Peng, ZHOU Qi, WANG Kehong, ZHANG Deku, HE Peng, LONG Weimin, ZHONG Sujuan. Effect of Ga/Nd composite additive on the wettability and microstructure of low silver Sn-Ag-Cu solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(3): 33-36.
Citation: XUE Peng, ZHOU Qi, WANG Kehong, ZHANG Deku, HE Peng, LONG Weimin, ZHONG Sujuan. Effect of Ga/Nd composite additive on the wettability and microstructure of low silver Sn-Ag-Cu solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(3): 33-36.
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复合添加Ga/Nd对超低银SAC钎料组织和性能的影响

  • 1.

    南京理工大学材料科学与工程学院, 南京 210094

  • 2.

    哈尔滨工业大学先进焊接与连接国家重点实验室, 哈尔滨 150001

  • 3.

    郑州机械研究所新型钎焊材料与技术国家重点实验室, 郑州 450001

基金项目: 新型钎焊材料与技术国家重点实验室开放课题(郑州机械研究所SKLABFMT201604);江苏省自然科学基金资助项目(BK20131261)

Effect of Ga/Nd composite additive on the wettability and microstructure of low silver Sn-Ag-Cu solder

  • 1.

    School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing 210094, China

  • 2.

    State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

  • 3.

    State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China

摘要

    摘要
  • 摘要: 研究了复合添加Ga/Nd对超低银Sn-0.3Ag-0.7Cu钎料组织和性能的影响.结果表明,复合添加微量Ga/Nd元素(0.025~1%)可以显著改善钎料的润湿性能,当Nd元素的添加量为0.1%时钎料的润湿时间最短,润湿力,此时钎料在250℃时的润湿时间已达到了波峰焊的应用标准.添加适量Ga/Nd元素后钎料组织得到了明显细化,当Nd元素的添加量为0.1%时钎料组织最为细小均匀,同时焊点抗剪力相比母合金提升了约15%.当添加过量稀土元素后,结果表明,在钎料组织中并未发现明显的稀土相,说明Ga/Nd复合添加对稀土相的生成起到了一定的抑制作用.
    Abstract: The effect of Ga/Nd composite additive on the wettability and microstructure of n-0.3Ag-0.7Cu solder were investigated.The results indicated that the composite additive of Ga and Nd could greatly improve the wettability of solder, the optimal wettability of solder was obtained when the addition of Nd reached 0.1 wt.%. After adding moderate amount of Ga and Nd, the microstructure of solder was refined andthe shear strength of soldered joint was improved by 15%. Compared with the previous results that excessive amount of Nd was added, no obviously Sn-Nd phase observed in the solder, indicating that the composite additive of Ga and Nd could inhibit the formation of Sn-Nd phase to a certain extent.
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    • 参考文献(12)
  • [1] Anderson I E, Cook B A, Harringa J L, et al. Sn-Ag-Cu solders and solder joints:alloy development, microstructure, and properties[J]. JOM, Journal of the Minerals, Metals and Materials Society, 2002, 54(6):26-29.
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    [6] A.E. Hammad. Investigation of microstructure and mechanical properties of novel Sn-0.5Ag-0.7Cu solders containing small amount of Ni[J]. Materials and Design, 2013, 50(9):108-116.
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    [8] Council of Japan Industry Standard, J IS Z 3198-2 test methods for lead-free solders-Part 4:methods for solderability test by a wetting balance method and a contact angle method[S]. Japan:2003.
    [9] Association Connecting Electronics Industries, IPC-SM-785, Guidelines for accelerated reliability testing of surface Mount solder attachments[S]. Illinois:1992.
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    [11] 郝虎, 李广东, 史耀武, 等. SnAgCuCe/Er无铅钎料表面锡晶须的形态及特性[J]. 焊接学报, 2009, 30(5):25-28. HAO Hu, LI Guangdong, SHI Yaowu, et al. Morphologies and characteristics of tin whiskers on surface of SnAgCuCe/Er lead-free solder[J]. Transactions of the China Welding Institution, 2009, 30(5):25-28.
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  • 收稿日期:  2016-01-07

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