基于灰色模型的焊点健康状态预测
Prediction on health of welded point based on gray model
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摘要: 随着BGA(ball grid array)封装FPGA在武器系统及航空航天领域的应用越来越广泛,其焊点健康状况越来越受到关注. 利用灰色系统理论,有效解决了焊点失效模型建立过程中数据样本少且无明显规律、焊点失效过程难以预测等难题. 文中将焊点故障诊断过程中得到的前期故障实测数据作为原始数据,建立焊点失效灰色模型,并对焊点后期健康状况进行预测,预测结果与实测结果对比发现,预测精度为一级. 结果表明,基于灰色系统的焊点健康状态预测模型,做到了焊点故障的提前预警,克服了监测周期长、焊点故障难以预测、一旦发现即失效等问题.Abstract: With the wider use of FPGA with BGA encapsulation in the aerospace and weapon system, the health status of welded point is attracting more and more attention. In this paper, the gray system theory is used to solve problems such as lack of data points, no obvious regularity, difficult to predict, etc., while establishing failure model for welded point. A failure model of welded point is established using the data measured during fault diagnosis as original data. The prediction about the later health status of welded point is made, and the comparison of predicted and measured results reveals that the prediction accuracy is in level 1. The experimental results show that the prediction model for health status of welded point based on gray system theory can alert before the failure of welded point, and overcome the problems of long cycle, being difficult to predict failure of welded point and instant failure after being found.
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Keywords:
- gray system theory /
- prediction of health /
- BGA encapsulation /
- FPGA
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[1] 戴 玮, 薛松柏, 张 亮, 等. 不同阵列PBGA器件焊点可靠性分析[J]. 焊接学报, 2009, 30(9): 73-76. Dai Wei, Xue Songbai, Zhang Liang, et al. Analysis on soldered joint reliability of PBGA package with different arrangement models[J]. Transactions of the China Welding Institution, 2009, 30(9): 73-76. [2] Liu C, Wang J Y, Zhang A T. Research on the fault diagnosis technology of intermittent connection failure belonging to FPGA solder-joints in BGA package[J]. Optik-International Journal for Light and Electron Optics, 2013, 125(2): 737-740. [3] 陈 颖, 康 锐. 球栅阵列封装焊点寿命预测的综合方法[J]. 焊接学报, 2009, 30(11): 105-108. Chen Ying, Kang Rui. Integrated life prediction method of ball grid array soldered joint[J]. Transactions of the China Welding Institution, 2009, 30(11): 105-108. [4] Perkins A, Sitaraman S K. Universal fatigue life prediction equation for ceramic ball grid array (CBGA) packages[J]. Microelectronics Reliability, 2007, 47(12): 2260-2274. [5] 张瑞秋, 张宪民, 陈 忠, 等. 基于三维X射线和Fisher准则的BGA焊点检测算法[J]. 焊接学报, 2011, 33(4): 13-16. Zhang Ruiqiu, Zhang Xianmin, Chen Zhong, et al. BGA solder joint inspection algorithm based on 3D X-ray and Fisher criterion[J]. Transactions of the China Welding Institution, 2011, 33(4): 13-16. [6] 邓聚龙. 灰色系统理论教程[M]. 武汉: 华中理工大学出版社, 1990. -
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