加载速率和钎料厚度对SnAgCu/Cu焊点剪切行为影响

高瑞婷; 李晓延; 朱永鑫; 王超

加载速率和钎料厚度对SnAgCu/Cu焊点剪切行为影响

北京工业大学材料科学与工程学院, 北京 100124

基金项目: 国家自然科学基金资助项目(51275007);北京市教委科研计划重点项目(KZ201410005009)

计量
- 文章访问数: 523
- HTML全文浏览量: 12
- PDF下载量: 228
出版历程
- 收稿日期: 2014-05-07

Effect of loading rates and solder thickness on shear behavior of SnAgCu/Cu lead-free solder joint

College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

摘要

摘要: 采用四种加载速率(1,0.1,0.01,0.001 mm/s),对四种钎料厚度(0.1,0.2,0.3,0.6 mm)的SnAgCu/Cu搭接焊点进行了剪切破坏试验,分析了不同加载速率以及钎料尺寸对焊点抗剪切性能的影响,并通过扫描电镜(SEM)和能谱仪(EDS)分析了剪切试样断口形貌、裂纹的萌生位置及扩展路径,阐释了SnAgCu/Cu焊点断裂失效机理. 结果表明,加载速率在0.001~1 mm/s范围内,焊点抗剪切强度随加载速率的增加而增大,不同加载速率条件下焊点的断裂模式都为韧性断裂. 不同钎料厚度的SnAgCu/Cu焊点随着焊点厚度的减小,其抗剪切性能提高,表现出明显的体积效应,其裂纹萌生位置逐渐由焊点内部向IMC层转移. 焊点断口形貌为拉伸撕裂型伸长韧窝和剪切平面,断裂机理为微孔聚集型-纯剪切复合断裂.
- 无铅焊点 /
- 剪切性能 /
- 体积效应 /
- 可靠性 /
- 裂纹萌生
Abstract: Single shear lap SnAgCu/Cu solder joints with different thicknesses (0.1, 0.2, 0.3, 0.6 mm) were tested at various loading rates (0.001, 0.01, 0.1, 1 mm/s) with an Instron5948 Micro Tester. The results show that the shear strength of solder joints increased with the increase of loading rates, and increased with the decrease of solder thickness, showing an apparent size effect. Scanning Electron Microscopy (SEM) and Energy Dispersive Spectrometer (EDS) were used to analyze the morphology of shear fracture and the crack initiation on the surface of solder joints, the crack initiation location gradually shifted to IMC layer from the solder with the decrease of solder thickness. The fracture morphology of solder joints had elongated dimples and shear planes, and the failure mechanism was micro-void aggregation/pure shear hybrid fracture.
- lead-free solder joint /
- shear property /
- size effect /
- reliability /
- crack initiation

HTML全文

参考文献(9)

[1]	李晓延, 严永长. 电子封装焊点可靠性及寿命预测方法[J]. 机械强度, 2005, 27(4): 470-479. Li Xiaoyan, Yan Yongchang. Reliability and life prediction methodologies for solder joints of electronic package[J]. Journal of Mechanical Strength, 2005, 27(4): 470-479.
[2]	尹立孟, Michael P, 位松, 等. 焊点高度对微尺度焊点力学行为的影响[J]. 焊接学报, 2013, 34(8): 27-30. Yin Limeng, Michael P, Wei Song, et al. Effect of joint height on the mechanical behavious of microscale solder joints[J]. Transactions of the China Welding Institution, 2013, 34(8): 27-30.
[3]	Braun T, Becker K F, Koch M, et al. High-temperature reliability of flip chip assemblies[J]. Microelectronics Reliability, 2006, 46(1): 144-154.
[4]	Zimprich P, Betzwar-Kotas A, Khatibi G, et al. Size effects in small scaled lead-free solder joints[J]. Journal of Materials Science-Materials in Electronics, 2008, 19(4): 383-388.
[5]	Zimprich P, Saeed U, Betzwar-Kotas A, et al. Mechanical size effects in miniaturized lead-free solder joints[J]. Journal of Electronic Materials, 2008, 37(1): 102-109.
[6]	王春青, 王学林, 田艳红. SnAgCu无铅微焊点剪切力学性能的体积效应[J]. 焊接学报, 2011, 32(4): 1-4. Wang Chunqing, Wang Xuelin, Tian Yanhong. Volume effect on shear strength of SnAgCu lead-free solder joints[J]. Transactions of the China Welding Institution, 2011, 32(4): 1-4.
[7]	芦伟, 张宁, 史耀武, 等. 加载速率对SnAgCu钎焊接头抗剪强度的影响[J]. 焊接学报, 2010, 31(9): 57-60. Lu Wei, Zhang,Ning, Shi Yaowu, et al. Effect of loading rate on shear strength of SnAgCu solder joint[J]. Transactions of the China Welding Institution, 2010, 31(9): 57-60.
[8]	钟群鹏, 赵子华. 断口学[M]. 北京: 高等教育出版社, 2005.
[9]	田艳红, 杨世华, 王春青, 等. Sn3.0Ag0.5Cu/Cu无铅微焊点剪切断裂行为的体积效应[J]. 金属学报, 2010, 46(3): 366-371. Tian Yanhong, Yang Shihua, Wang Chunqing, et al. Volume effect of shear fracture behavior of Sn3.0Ag0.5Cu/Cu lead-free solder joints[J]. Acta Metallyrgica Sinica, 2010, 46(3): 366-371.

施引文献

资源附件(0)

计量

文章访问数: 523
HTML全文浏览量: 12
PDF下载量: 228
被引次数: 0

加载速率和钎料厚度对SnAgCu/Cu焊点剪切行为影响

计量

出版历程

Effect of loading rates and solder thickness on shear behavior of SnAgCu/Cu lead-free solder joint

计量

出版历程

目录