热冲击条件下倒装组装微焊点的可靠性-寿命预测

基金项目: 国家自然科学基金资助项目(U1504507);河南工业大学高层次人才基金项目(2012BS053)

Prediction of reliability of solder joint for fine pitch flip chip assemblies under thermal shock

1.
School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou 45000, China;School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
2.
School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou 45000, China

摘要: 采用有限元模拟法分析在-55~125℃热冲击过程中倒装微焊点的失效情况,结合模拟及试验数据,根据以能量为基础的Darveaux寿命模型预测关键焊点的疲劳寿命. 结果表明,组装体边角焊点最易失效,裂纹形成在芯片侧焊盘附近的焊料基体中,由焊点的外侧向内侧扩展;根据裂纹平均生长速率和微焊点累积塑性应变能密度,计算获得微焊点Darveaux寿命模型参数K₁,K₂,K₃及K₄分别为1 648.96,-0.234 9,0.004 79及-0.700 4,边角微焊点的疲劳寿命为6171次循环.
- 倒装芯片 /
- 微焊点 /
- 热冲击 /
- 可靠性 /
- 寿命预测
Abstract: The finite element method was used to analyze the failure of solder joint for fine pitch flip chip assemblies under thermal shock ranging from -55 to 125℃. The fatigue life of critical solders was predicted based on Darveaux lifetime prediction model. The results show that the corner solder failed easiest, and the crack initiated in the solder along the accessory besides the chip, propagating from outside to inside. According to the average crack growth rate and accumulated plastic work density in solder joint, the parameters K₁, K₂, K₃, K₄ for Darveaux lifetime model were calculated to be 1 648.96, -0.234 9, 0.004 79 and -0.700 4 respectively, and the predicted fatigue life of the corner solder was 6171 cycles.
- flip chip /
- micron-solder joint /
- reliability /
- fatigue life

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