微光机电系统封装芯片粘结剂层温度循环应力应变分析
Study on stress and strain of adhesive fillet of MOEMS package under temperature cycle
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摘要: 对微光机电系统(micro optical electro mechanical systems,MOEMS)芯片粘结剂层进行了温度循环应力应变有限元分析. 以粘结剂厚度、溢出高度和溢出宽度三个结构参数作为关键因素,采用正交表设计了25种不同水平组合的粘结剂层,获取了25组应力应变数据并进行方差分析. 结果表明,在置信度95%时,粘结层厚度和溢出宽度对应力有显著影响;粘结层厚度对应变有显著影响;各因素对应力应变影响排序为:粘结层厚度影响最大,其次是溢出宽度,最后是溢出高度;粘结剂层内最大应力应变随粘结剂层厚度和溢出宽度的增加而减小.Abstract: The stress and strain distribution on adhesive fillet of micro optical electro mechanical systems(MOEMS) package were analyzed under temperature cycle by using finite element analysis (FEA). The adhesive fillet thickness, fillet height and width were selected as three key configuration parameters, and an orthogonal design consisting of the 25 different combinations were conducted. The maximum stress and strain within the adhesive fillet were obtained. The variance analyses of stress and strain were performed. The results show that with 95% confidence, the adhesive fillet thickness and adhesive width have significant effect on the stress, the adhesive fillet thickness has significant effect on the strain. The adhesive fillet thickness, the adhesive width and the adhesive fillet height affect the stress and strain in a descending order. When the other parameters is unchanged, the maximum stress and strain descend with the increasing of the adhesive fillet thickness and the adhesive width under temperature load.