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微光机电系统封装芯片粘结剂层温度循环应力应变分析

梁颖, 黄春跃, 张欣, 黄伟, 李天明

梁颖, 黄春跃, 张欣, 黄伟, 李天明. 微光机电系统封装芯片粘结剂层温度循环应力应变分析[J]. 焊接学报, 2016, 37(1): 6-10.
引用本文: 梁颖, 黄春跃, 张欣, 黄伟, 李天明. 微光机电系统封装芯片粘结剂层温度循环应力应变分析[J]. 焊接学报, 2016, 37(1): 6-10.
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LIANG Ying, HUANG Chunyue, ZHANG Xin, HUANG Wei, LI Tianming. Study on stress and strain of adhesive fillet of MOEMS package under temperature cycle[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(1): 6-10.
Citation: LIANG Ying, HUANG Chunyue, ZHANG Xin, HUANG Wei, LI Tianming. Study on stress and strain of adhesive fillet of MOEMS package under temperature cycle[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2016, 37(1): 6-10.
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微光机电系统封装芯片粘结剂层温度循环应力应变分析

  • 1.

    成都航空职业技术学院 电子工程系, 成都 610021

  • 2.

    桂林电子科技大学 机电工程学院, 桂林 541004

  • 3.

    桂林航天工业学院 汽车与动力工程系, 桂林 541004

基金项目: 国家自然科学基金资助项目(51465012);广西壮族自治区自然科学基金资助项目(2015GXNSFCA139006,2013GXNSFAA019322);四川省教育厅科研资助项目(13ZB0052)

Study on stress and strain of adhesive fillet of MOEMS package under temperature cycle

  • 1.

    Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu 610021, China

  • 2.

    School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China

  • 3.

    Department of Automobile and Power Engineering, Guilin University of Aerospace Technology, Guilin 541004, China

摘要

    摘要
  • 摘要: 对微光机电系统(micro optical electro mechanical systems,MOEMS)芯片粘结剂层进行了温度循环应力应变有限元分析. 以粘结剂厚度、溢出高度和溢出宽度三个结构参数作为关键因素,采用正交表设计了25种不同水平组合的粘结剂层,获取了25组应力应变数据并进行方差分析. 结果表明,在置信度95%时,粘结层厚度和溢出宽度对应力有显著影响;粘结层厚度对应变有显著影响;各因素对应力应变影响排序为:粘结层厚度影响最大,其次是溢出宽度,最后是溢出高度;粘结剂层内最大应力应变随粘结剂层厚度和溢出宽度的增加而减小.
    Abstract: The stress and strain distribution on adhesive fillet of micro optical electro mechanical systems(MOEMS) package were analyzed under temperature cycle by using finite element analysis (FEA). The adhesive fillet thickness, fillet height and width were selected as three key configuration parameters, and an orthogonal design consisting of the 25 different combinations were conducted. The maximum stress and strain within the adhesive fillet were obtained. The variance analyses of stress and strain were performed. The results show that with 95% confidence, the adhesive fillet thickness and adhesive width have significant effect on the stress, the adhesive fillet thickness has significant effect on the strain. The adhesive fillet thickness, the adhesive width and the adhesive fillet height affect the stress and strain in a descending order. When the other parameters is unchanged, the maximum stress and strain descend with the increasing of the adhesive fillet thickness and the adhesive width under temperature load.
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    • 参考文献(8)
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  • 收稿日期:  2014-04-26

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