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TiO2纳米颗粒掺杂对Sn-3.0Ag-0.5Cu-xTiO2焊点界面Cu6Sn5IMC晶粒生长的影响机理

唐宇, 骆少明, 王克强, 李国元

唐宇, 骆少明, 王克强, 李国元. TiO2纳米颗粒掺杂对Sn-3.0Ag-0.5Cu-xTiO2焊点界面Cu6Sn5IMC晶粒生长的影响机理[J]. 焊接学报, 2015, 36(12): 56-60.
引用本文: 唐宇, 骆少明, 王克强, 李国元. TiO2纳米颗粒掺杂对Sn-3.0Ag-0.5Cu-xTiO2焊点界面Cu6Sn5IMC晶粒生长的影响机理[J]. 焊接学报, 2015, 36(12): 56-60.
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TANG Yu, LUO Shaoming, WANG Keqiang, LI Guoyuan. Influence of nano-TiO2 dopant on Cu6Sn5 IMC grain ripening growth in Sn-3.0Ag-0.5Cu-x TiO2 solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(12): 56-60.
Citation: TANG Yu, LUO Shaoming, WANG Keqiang, LI Guoyuan. Influence of nano-TiO2 dopant on Cu6Sn5 IMC grain ripening growth in Sn-3.0Ag-0.5Cu-x TiO2 solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(12): 56-60.
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TiO2纳米颗粒掺杂对Sn-3.0Ag-0.5Cu-xTiO2焊点界面Cu6Sn5IMC晶粒生长的影响机理

  • 1.

    仲恺农业工程学院 自动化学院, 广州 510225;华南理工大学 电子与信息学院, 广州 510640

  • 2.

    仲恺农业工程学院 自动化学院, 广州 510225

  • 3.

    华南理工大学 电子与信息学院, 广州 510640

基金项目: 中央高校基本科研业务费专项资金资助项目(2014ZB0032);广东省自然科学基金资助项目(2014A030313594);广东省科技计划资助项目(2014A020208139; 2015A020209179);广东高校特色创新资助项目(KA1548812)

Influence of nano-TiO2 dopant on Cu6Sn5 IMC grain ripening growth in Sn-3.0Ag-0.5Cu-x TiO2 solder joints

  • 1.

    College of Information, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China;School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China

  • 2.

    College of Information, Zhongkai University of Agriculture and Engineering, Guangzhou 510225, China

  • 3.

    School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China

摘要

    摘要
  • 摘要: 研究了TiO2纳米颗粒掺杂影响回流焊过程中Sn-3.0Ag-0.5Cu-xTiO2焊点界面Cu6Sn5金属间化合物(intermetallic compound,IMC)晶粒生长机理. 基于Cu原子扩散通量驱动晶粒成熟生长(flux driven ripening,FDR)理论模型分析了Cu6Sn5 IMC晶粒生长机理. 结果表明,TiO2纳米颗粒掺杂改变了焊点界面Cu6Sn5 IMC晶粒形貌和尺寸. 含TiO2纳米颗粒的焊点Cu6Sn5 IMC晶粒尺寸要小于不含TiO2纳米颗粒的焊点,且晶粒分布要更加均匀. 试验数据与FDR理论模型基本吻合. Cu6Sn5 IMC晶粒生长指数分别为0.346,0.338,0.332和0.342,这说明Cu6Sn5 IMC晶粒生长是由原子互扩散和晶粒成熟共同控制.
    Abstract: Effect of nano-TiO2 dopant on Cu6Sn5 IMC grain ripening growth in Sn-3.0Ag-0.5Cu-xTiO2 solder joints during reflow process was investigated in this study. Flux-driven ripening (FDR) theoretical model is adopted to analyze the Cu6Sn5 IMC grain ripening growth mechanism. Results show that nano-TiO2 dopant could alter both the morphology and size of Cu6Sn5 IMC grain. The size of Cu6Sn5 IMC grain in TiO2-containg solder joints is smaller than that in TiO2-free solder joints, and the Cu6Sn5 IMC grain in TiO2-containg solder joints is more uniform and evenly distributed than those in TiO2-free solder joints. The FDR theoretical model was well consistent with the experimental data. The growth exponents of Cu6Sn5 IMC grain in Sn-3.0Ag-0.5Cu-xTiO2 solder joints are 0.346, 0.338, 0.332, and 0.342, respectively. This indicates that Cu6Sn5 IMC grain growth is controlled by atomic interdiffusion and grain maturity.
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    • 参考文献(11)
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  • 收稿日期:  2014-11-24

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