Abstract: Anodic bonding technology is a common method in MEMS packaging technology. Currently only glass and metal, the glass and semiconductor materials bonding can by realized. Test using the PEO as matrix, compound with a small amount of nano inorganic filler, the preparation of a new type of solid composite polymer electrolyte as a new anodic bonding materials, by means of DSC and XRD analysis means to study the interaction of PEO and inorganic filler and conductive mechanism, and then discusses the polymer solid electrolyte as a new type of packaging materials in the feasibility in application of anodic bonding,The results show that the addition of PEO can effectively inhibit the crystallization of PEO, and the bonding quality is good.