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3D-TSV互连结构随机振动加载应力分析

黄春跃, 熊国际, 梁颖, 邵良滨, 黄伟, 李天明

黄春跃, 熊国际, 梁颖, 邵良滨, 黄伟, 李天明. 3D-TSV互连结构随机振动加载应力分析[J]. 焊接学报, 2015, 36(11): 17-20.
引用本文: 黄春跃, 熊国际, 梁颖, 邵良滨, 黄伟, 李天明. 3D-TSV互连结构随机振动加载应力分析[J]. 焊接学报, 2015, 36(11): 17-20.
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HUANG Chunyue, XIONG Guoji, LIANG Ying, SHAO Liangbin, HUANG Wei, LI Tianming. Study on stress distribution of 3D-TSV interconnect structure under random vibration load[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(11): 17-20.
Citation: HUANG Chunyue, XIONG Guoji, LIANG Ying, SHAO Liangbin, HUANG Wei, LI Tianming. Study on stress distribution of 3D-TSV interconnect structure under random vibration load[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(11): 17-20.
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3D-TSV互连结构随机振动加载应力分析

  • 1.

    桂林电子科技大学 机电工程学院, 桂林 541004

  • 2.

    成都航空职业技术学院 电子工程系, 成都 610021

  • 3.

    桂林航天工业学院 汽车与动力工程系, 桂林 541004

基金项目: 国家自然科学基金资助项目(51465012);广西壮族自治区自然科学基金资助项目(2015GXNSFCA139006,2013-GXNSFAA019322)

Study on stress distribution of 3D-TSV interconnect structure under random vibration load

  • 1.

    School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China

  • 2.

    Department of Electronic Engineering, Chengdu Aeronautic Vocational and Technical College, Chengdu 610021, China

  • 3.

    Department of Automobile and Power Engineering, Guilin University of Aerospace Technology, Guilin 541004, China

摘要

    摘要
  • 摘要: 建立了三维硅通孔 (three-dimension through silicon via,3D-TSV )互连结构有限元分析模型,对该模型进行了随机振动加载有限元分析. 选取TSV高度、TSV直径、微凸点高度和微凸点直径四个结构参数作为关键因素,采用水平正交表L16(45)设计了16种不同结构参数的3D-TSV互连结构,获取了这16种3D-TSV互连结构随机振动应力数据并进行了方差分析. 结果表明,在置信度为99%的情况下,TSV高度对3D-TSV互连结构随机振动应力有显著影响,因素显著性的排序由大到小为TSV高度最大,其次为TSV直径,再次为微凸点直径,最后是微凸点高度;单因子变量分析表明,TSV互连结构应力应变随TSV高度的增加而增大.
    Abstract: The 3D finite element analysis models of 3D-TSV interconnect structure were developed. By using ANSYS, the finite element analysis of the stress distribution in the model was performed under the condition of thermal-structure coupling. The TSV height and the TSV diameter, the micro-bump height and the micro-bump diameter were selected as four key configuration parameters, combinations were designed. By using an L16(45) orthogonal array the 3D-TSV which have 16 different configuration parameters' levels. The maximum stress values within 3D-TSV were obtained. Variance analysis was performed based on the values of stress. The results show that the TSV height has highly significant impact on the stress of 3D-TSV under random vibration with 99% confidence. The TSV height, the TSV diameter, the micro-bump diameter and the micro-bump height affect the stress of 3D-TSV in a descending order. The single-factor analysis of variance shows that the stress and strain in TSV interconnect structure increase with the height of TSV.
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    • 参考文献(8)
  • [1] Banijamali B, Ramalingam S, Liu H, et al. Outstanding and innovative reliability study of 3D TSV interposer and fine pitch solder micro-bumps[C]// IEEE 62nd Electronic Components and Technology Conference, San Diego, 2012: 309-314.
    [2] Thakur S, Nakanekar S, Kaisare A, et al. Design for reliability of stacked die package using TSV technology[C]// ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, Portland, 2011: 75-82.
    [3] Frank T, Moreau S, Chappaz C, et al. Reliability of TSV interconnects: electro-migration, thermal cycling, and impact on above metal level dielectric[J]. Microelectronics Reliability, 2013, 53(1): 17-29.
    [4] 俞箭飞, 江五贵. 穿透硅通孔互连结构的湿-热应力有限元分析[J]. 半导体技术, 2012, 37(11): 70-74. Yu Jianfei, Jiang Wugui. Finite element analysis of the thermal-hygroscopic stress of the through silicon vias (TSV) interconnect structure[J]. Semiconductor Technology, 2012, 37(11): 70-74.
    [5] 安 彤, 秦 飞, 武 伟, 等. TSV 转接板硅通孔的热应力分析[J]. 工程力学, 2013, 30(7): 262-269. An Tong, Qin Fei, Wu Wei, et al. Analysis of thermal stress in through silicon vias of interposer[J]. Engineering Mechanics, 2013, 30(7): 262-269.
    [6] 黄春跃, 吴兆华, 周德俭. 热冲击条件下1.27 mm引脚间距塑封球栅阵列器件焊点可靠性测试与分析[J]. 焊接学报, 2005, 26(9): 31-34. Huang Chunyue, Wu Zhaohua, Zhou Dejian. Reliability test and analysis of 1.27 mm pitch plastic ball grid array soldered joint under thermal shock[J]. Transactions of the China Welding Institution, 2005, 26(9): 31-34.
    [7] 田艳红, 王 宁, 杨东升, 等. 三维封装芯片键合IMC焊点应力分析及结构优化[J]. 焊接学报, 2012, 33(8): 17-20. Tian Yanhong, Wang Ning, Yang Dongsheng, et al. Stress analysis and structure optimization of IMC joints in 3D package[J]. Transactions of the China Welding Institution, 2012, 33(8): 17-20.
    [8] 陶博浩, 李 红, 宋永伦, 等. 电阻点焊冷轧DP600双相钢焊接接头性能的正交试验分析[J]. 焊接学报, 2013, 34(6): 81-84. Tao Bohao, Li Hong, Song Yonglun, et al. Analysis of orthogonal test of properties of dual-phase DP600 steel resistance spot welded joint[J]. Transactions of the China Welding Institution, 2013, 34(6): 81-84.
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  • 收稿日期:  2014-02-13

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