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多场耦合条件下SnAgCu/Cu界面化合物生长行为

许媛媛, 闫焉服, 李帅, 赵永猛

许媛媛, 闫焉服, 李帅, 赵永猛. 多场耦合条件下SnAgCu/Cu界面化合物生长行为[J]. 焊接学报, 2015, 36(10): 44-48.
引用本文: 许媛媛, 闫焉服, 李帅, 赵永猛. 多场耦合条件下SnAgCu/Cu界面化合物生长行为[J]. 焊接学报, 2015, 36(10): 44-48.
XU Yuanyuan, YAN Yanfu, LI Shuai, ZHAO Yongmeng. Growth behavior of intermetallic compounds between SnAgCu and Cu substrate under multiphysics field coupling[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(10): 44-48.
Citation: XU Yuanyuan, YAN Yanfu, LI Shuai, ZHAO Yongmeng. Growth behavior of intermetallic compounds between SnAgCu and Cu substrate under multiphysics field coupling[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(10): 44-48.

多场耦合条件下SnAgCu/Cu界面化合物生长行为

基金项目: 国家自然科学基金资助项目(51175151)

Growth behavior of intermetallic compounds between SnAgCu and Cu substrate under multiphysics field coupling

  • 摘要: 基于自制的多场耦合热循环装置,研究了Sn-3.0Ag-0.5Cu/Cu钎焊接头热循环过程中界面金属间化合物(IMC)微观组织变化和断裂行为. 结果表明,在多场耦合及30~150 ℃热疲劳循环下,随着循环周期的增加,界面IMC厚度越来越厚,且在较短循环时间内IMC的形貌由扇贝状转变为层状,400周期后界面化合物的厚度增长变缓;当循环周期达到600时,界面上空洞聚集长大,产生界面开裂,进而导致疲劳失效. 同时随着循环周期增加,接头的抗剪强度也逐渐下降,也有脆性断裂的趋势.
    Abstract: Based on the home-made multiphysics field coupling device, investigation was carried on the fracture behavior and the growth of intermetallic compounds (IMC) at the interface between Sn-3.0Ag-0.5Cu lead-free solder and Cu substrate. The results show that in the multiphysics field and 30-150 ℃ thermal fatigue cycles,the more the thermal fatigue cycles, the faster the IMC grows in the same aging temperature. The morphology of IMC changes from the scallop shape into the layered shape in a shorter cycle time. The growth of IMC is slowing down after 400 cycles. When the cycles are 600, the void gathered and grow up, resulting in interface cracks and fatigure failure. With the increasing thermal cycles, the shear strength of joint drops quickly and it also has a tendency to brittle fracture.
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  • 收稿日期:  2014-01-21

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