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CuNiSnTi钎料钎焊立方氮化硼界面产物分析

王毅, 阮野, 董文, 雷凯

王毅, 阮野, 董文, 雷凯. CuNiSnTi钎料钎焊立方氮化硼界面产物分析[J]. 焊接学报, 2015, 36(8): 71-74.
引用本文: 王毅, 阮野, 董文, 雷凯. CuNiSnTi钎料钎焊立方氮化硼界面产物分析[J]. 焊接学报, 2015, 36(8): 71-74.
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WANG Yi, RUAN Ye, DONG Wen, LEI Kai. Analysis on interfacial products of the joint of cubic boron nitride brazed to CuNiSnTi filler metal[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(8): 71-74.
Citation: WANG Yi, RUAN Ye, DONG Wen, LEI Kai. Analysis on interfacial products of the joint of cubic boron nitride brazed to CuNiSnTi filler metal[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(8): 71-74.
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CuNiSnTi钎料钎焊立方氮化硼界面产物分析

  • 1.

    长春工程学院机电学院, 长春 130012

  • 2.

    一汽轿车股份有限公司, 长春 130012

基金项目: 吉林省教育厅资助项目(吉教科合字[2014]第535号);长春工程学院校种子基金资助项目(320140018)

Analysis on interfacial products of the joint of cubic boron nitride brazed to CuNiSnTi filler metal

  • 1.

    School of Mechatronics Engineering, Changchun Institute of Technology, Changchun 130012, China

  • 2.

    FAW Car Co., Ltd., Changchun 130000, China

摘要

    摘要
  • 摘要: 采用扫描电镜、能谱仪、微区X射线衍射仪研究了CuNiSnTi活性钎料钎焊立方氮化硼(c-BN)界面产物的微观结构和形成机理,并运用动力学分析了界面反应产物的生长过程及反应激活能.结果表明,钎焊过程中CuNiSnTi钎料对c-BN具有良好的润湿性,钎料与c-BN发生化学反应,实现c-BN与钢基体的可靠连接;钎料与c-BN界面处生成Ti-N和Ti-B化合物新相,形成了钎料/TiN/TiB/TiB2/c-BN的结构形式;在钎焊温度1323~1398 K,保温时间5~20 min之间依据抛物线生长法则指出界面处产生的化学反应和原子间的相互扩散是促使界面反应层形成与生长的主要因素及形成机理.
    Abstract: The microstructure and formation mechanism of the products in the interface of the joint of c-BN brazed to CuNiSnTi filler metal were investigated by scanning electron microscope(SEM), energy dispersion spectrometer(EDS), as well as micro X-ray diffraction(XRD). Also, the growth process and diffusion activation energy of the interfacial reaction products were deeply studied with a kinetics theory. The results showed that the CuNiSnTi filler metal exhibited a good wettability on c-BN in the brazing. And the reaction between filler metal and c-BN occurred, therefore the reliable connection between c-BN and[JP2]steel substrate was realized. The new phase of Ti-N and Ti-B compounds were found in the interface between filler metal and c-BN. Then the formed structure of the interface was in the form of filler/TiN/TiB/TiB2/c-BN. The growth process of reaction layer depends mainly on the inter-diffusion among the atoms and chemical reaction generated at the interface in the brazing temperature of 1153-1193 K for 5-20 min following a parabolic rule.
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    • 参考文献(10)
  • [1] Ding W F, Xu J H, Chen Z Z, et al. Interface characteristics and fracture behavior of brazed polycrystalline CBN grains using Cu-Sn-Ti alloy[J]. Materials Science and Engineering A, 2013, 559:629-634.
    [2] 丁文锋,徐九华,卢金斌,等.高温钎焊立方氮化硼界面微观结构[J].焊接学报, 2004, 25(5):29-32. Ding Wenfeng, Xu Jiuhua, Lu Jinbin, et al. Microstructure of high temperature brazing cubic boron hitride grits[J]. Transactions of the China Welding Institution, 2004, 25(5):29-32.
    [3] 王毅,邱小明,卢广林,等.多元铜基活性钎料对c-BN的润湿性与微观组织[J].焊接学报, 2009, 30(2):133-136. Wang Yi, Qiu Xiaoming, Lu Guanglin, et al. Wettability and microstructure of multicomponent Cu-based active filler metal on c-BN[J]. Transactions of the China Welding Institution, 2009, 30(2):133-136.
    [4] 张志伟,徐九华,丁文锋,等.铜锡钛合金炉中钎焊立方氮化硼界面微观结构[J].焊接学报, 2011, 32(1):73-76. Zhang Zhiwei, Xu Jiuhua, Ding Wenfeng, et al. Interfacial microstructure of cubic boron nitride grains brazed with Cu-Sn-Ti filler alloy in vacuum furnace[J]. Transactions of the China Welding Institution, 2011, 32(1):73-76.
    [5] Zhang J F, Tu R, Goto T. Spark plasma sintering of Al2O3-cBN composites facilitated by Ni nanoparticle precipitation on cBN powder by rotary chemical vapor deposition[J]. Journal of the European Ceramics Society, 2011, 31:2083-2087.
    [6] Hotta M, Goto T. Effect of time on microstructure and hardness of βSiAlON-cubic boron nitride composites during spark plasma sintering[J]. Ceramics International, 2011, 37:521-524.
    [7] Li J K, Liu L, Wu Y T, et al. Microstructure of high temperature Ti-based brazing alloys and wettability on SiC ceramic[J]. Materials and Design, 2009, 30(2):275-279.
    [8] Zhang J, Guo Y L, Naka M, et al. Microstructure and reaction phases in Si3N4/Si3N4 joint brazed with Cu-Pd-Ti filler alloy[J]. Ceramics International, 2008, 34(5):1159-1164.
    [9] Jost W. Diffusion in solids, liquids, gases[M]. New York:Academic Press Incorporated, 1960.
    [10] Frage N, Froumin N, Dariel M P. Wetting of TiC by non-reactive liquid metals[J]. Acta Materialia, 2002, 50(2):237-245.
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出版历程
  • 收稿日期:  2014-11-01

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