flash芯片SMT焊点抗高<em>g</em>值冲击性能分析

靳书云; 靳鸿; 张艳兵; 陈昌鑫

flash芯片SMT焊点抗高g值冲击性能分析

1.
中北大学仪器科学与动态测试教育部重点实验室, 太原 030051
2.
中北大学仪器科学与动态测试教育部重点实验室, 太原 030051;苏州大学机电工程学院, 苏州 215021

计量
- 文章访问数: 358
- HTML全文浏览量: 11
- PDF下载量: 109
出版历程
- 收稿日期: 2014-02-24

Analysis of anti-high g value impact of flash chip SMT solder joint

1.
Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, Taiyuan 030051, China
2.
Key Laboratory of Instrumentation Science & Dynamic Measurement, Ministry of Education, Taiyuan 030051, China;School of Mechanical Engineering, Soochow University, Suzhou 215021, China

摘要

摘要: 电子产品中电路板与芯片之间的焊点尺寸越来越小,在机械震动冲击过程中,焊点连接处是最容易被损坏的部位,为了研究机械震动冲击时SMT焊点抗高g(重力加速度约为10 m/s²)值冲击性能,利用霍普金森杆(Hopkinson bar)激光干涉仪对两片未灌封的动态参数测试的核心存储flash芯片的SMT焊点进行了抗高g值冲击性能试验. 结果表明,flash芯片SMT焊点在无多次冲击情况下,可以抗高达1.3×10⁵ g的冲击加速度,在累积冲击情况下,SMT焊点的抗冲击加速度幅值能力迅速减弱.
- 焊点 /
- 芯片 /
- 高冲击 /
- 未灌封 /
- 1.3× /
- 10⁵g
Abstract: The size of solder joints connecting the chip and PCB in electronic products is smaller and smaller. Solder joint is the part which most easily is to damaged in the process of mechanical vibration shock. In order to study the problem of anti-high g value impact of chip SMT solder joint, the test of anti-high g value impact of two flash chips SMT solder joint has been carried out by using Hopkinson bar laser interferometer. The flash chip is the core storage chip in dynamic parameter testing. Results show that the flash chip SMT solder joint can resist the impact of the 1.3×10⁵ g acceleration under the condition of no repeated impact and the ability to resist shock acceleration amplitude of SMT solder joint decreases rapidly in the cumulative impact cases.
- soldering joint /
- chip /
- high impact /
- no potting /
- 1.3× /
- 10⁵ g

HTML全文

参考文献(9)

[1]	王勇, 雷永平, 林健, 等.动态拉伸载荷下SMT焊点可靠性研究[J]. 电子工艺技术, 2009(2): 63-65, 69. Wang Yong, Lei Yongping, Lin Jian, et al. Research on reliability of SMT solder joint in dynamic tensile load[J]. Electronics Process Techology, 2009(2): 63-65,69.
[2]	王春青, 王学林, 田艳红, 等. SnAgCu无铅微焊点剪切力学性能的体积效应[J]. 焊接学报, 2011, 32(4): 1-4. Wang Chunqing, Wang Xuelin, Tian Yanhong, et al. Volume effect on shear strength of SnAgCu lead-free solder joints[J]. Transactions of the China Welding Institution, 2011, 32(4): 1-4.
[3]	胡玉华, 薛松柏, 杨晶秋, 等. 时效对Sn-Zn无铅钎料焊点可靠性的影响[J]. 焊接学报, 2012, 33(3): 41-44. Hu Yuhua, Xue Songbai, Yang Jingqiu, et al. Limitation of Sn-Zn lead-free solder joints reliability[J]. Transactions of the China Welding Institution, 2012, 33(3): 41-44.
[4]	徐鹏, 祖静, 李乐. CPLD芯片抗高g值冲击性能分析[J]. 振动与冲击, 2007, 26(1): 148-150. Xu Peng, Zu Jing, Li Le. Analysis of anti-multi-g-shock capability of a CPLD chip[J]. Journal of Vibration and Shock, 2007, 26(1): 148-150.
[5]	郇勇, 张泰华, 杨业敏, 等. 用Hopkinson杆冲击加载研究高量程微加速度计芯片的抗过载能力[J]. 传感技术学报, 2003, 16(2): 128-131. Xun Yong, Zhang Taihua, Yang Yemin, et al. Study of shock-resistibility of high-g microaccelerometer chip through impact using hopkinson bar[J]. Chinese Journal of Sensors and Actuators, 2003, 16(2): 128-131.
[6]	Tee T Y, Ng H S, Lim C T, et al. Drop test and impact life prediction model for QFN packages[J]. Journal of Surface Mount Technology, 2003, 16(3): 31-39.
[7]	Li J, Han L, Duan J, et al. Interface mechanism of ultrasonic flip chip bonding[J]. Applied Physics Letters, 2007, 90(24): 242902.
[8]	刘小康, 杨圣文, 蒋传文, 等. 硬盘磁头焊点优化及可靠性分析[J]. 焊接学报, 2006, 27(8): 83-87. Liu Xiaokang, Yang Shengwen, Jiang Chuanwen, et al. Joint optimizing and its reliability analysis of hand disk magnetic head[J]. Transactions of the China Welding Institution, 2006, 27(8): 83-87.
[9]	刘芳, 孟光. 跌落碰撞下SMT焊点可靠性研究进展[J]. 振动与冲击, 2007, 26(10): 92-95. Liu Fang, Meng Guang. Progress in research of SMT solder joint reliabliy during drop impact[J]. Journal of Vibration and Shock, 2007, 26(10): 92-95.