Abstract: The size of solder joints connecting the chip and PCB in electronic products is smaller and smaller. Solder joint is the part which most easily is to damaged in the process of mechanical vibration shock. In order to study the problem of anti-high g value impact of chip SMT solder joint, the test of anti-high g value impact of two flash chips SMT solder joint has been carried out by using Hopkinson bar laser interferometer. The flash chip is the core storage chip in dynamic parameter testing. Results show that the flash chip SMT solder joint can resist the impact of the 1.3×10⁵ g acceleration under the condition of no repeated impact and the ability to resist shock acceleration amplitude of SMT solder joint decreases rapidly in the cumulative impact cases.