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Al2O3陶瓷与5005铝合金的高频感应钎焊

Study of Al2O3 ceramic/5005 aluminum alloys high-frequency induction brazed joint

  • 摘要: 为实现Al2O3陶瓷与5005铝合金的低温连接,采用Ag-Cu-Ti粉末对Al2O3陶瓷表面进行活性金属化处理. 结果表明,当活性金属化温度为880~900 ℃,保温时间10 min时,在Al2O3陶瓷界面形成连续致密无缺陷的Ti3Cu3O反应层. 采用Al-Si钎料对活性金属化Al2O3陶瓷与5005铝合金进行高频感应钎焊,研究了接头的典型界面组织及其形成过程. 结果表明,当温度为600 ℃,保温时间为1 min时,铝合金侧由团状α-Al和晶间渗入的Al-Ag-Cu共晶组织构成,团状α-Al上有板条状初晶硅出现,Al2O3陶瓷侧有弥散分布的过共晶Al-Si组织,Ti3Cu3O反应层的形成是实现Al2O3陶瓷与5005铝合金可靠连接的关键,接头的最大抗剪强度达到52 MPa.

     

    Abstract: In order to achieve the complete joint of Al2O3 ceramics/5005 aluminum alloy at the low temperature, the Al2O3 ceramic were metallized with the Ag-Cu-Ti powder. It was shown that a continuous Ti3Cu3O reaction layer adjacented to the Al2O3 ceramic was confirmed. The interfacial structures and formation of the active metallized Al2O3/Al-Si/ 5005 aluminum alloys ceramic high-frequency induction brazed joints were analyzed. It was shown that the microstructure of the 5005 aluminum alloys/Al-Si/Al2O3 ceramic joint brazed at 600 ℃ for 1 min was: 5005 aluminum alloys/α-Al+Al-Ag-Cu eutectic +Si crystal /AlSi alloy +α-Al+ξ-Ag2Al/Ti3Cu3O/ Al2O3ceramic. The maximum shear strength was 52 MPa.

     

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