SAC305/Cu微焊点界面金属间化合物生长速率

Study on growth rate of interfacial metallic compound in SAC305/Cu joints

摘要: 界面金属间化合物(IMC)的生长速率是影响钎焊接头可靠性的重要因素. 文中研究了焊点尺寸、时效温度及镍镀层对SAC305/Cu微焊点界面IMC生长速率的影响. 结果表明,焊球尺寸为200,300,400和500 μm,时效温度为100,130,160 ℃条件下,界面IMC层厚度生长速率随时效时间平方根数值的升高而增长. 焊点尺寸由小变大,界面IMC层厚度更薄,IMC的生长速率也更小. 随着时效温度的升高,界面IMC生长速率增大. 镍镀层对界面IMC的生长速率有明显的抑制作用,即降低IMC生长速率,使其增厚变缓.

Abstract: The growth rate of interfacial intermetallic compounds (IMC) is an important factor to influence the reliability of a solder joint. In this paper, the effects of joint size, temperature and pre-plated nickel coating on the growth rate of interfacial IMC of SAC305/Cu micro joint were studied. The results showed that the growth rate of the interfacial IMC increases with the square root of aging time rising under the conditions: solder size 200, 300, 400, 500 μm, and aging temperature 100, 130, 160 ℃. Along with the joint size getting larger, the interfacial IMC thickness is thinner with smaller IMC growth rate. The growth rate of interfacial IMC increases with the temperature rising. The plated nickel coating suppresses the growth rate of interfacial IMC obviously, i.e. reducing the growth rate of IMC.