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SAC305/Cu微焊点界面金属间化合物生长速率

王建华,  孟工戈,  孙凤莲

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文章导航 > 焊接学报  > 2015 >  36(5): 47-50,76
王建华, 孟工戈, 孙凤莲. SAC305/Cu微焊点界面金属间化合物生长速率[J]. 焊接学报, 2015, 36(5): 47-50,76.
引用本文: 王建华, 孟工戈, 孙凤莲. SAC305/Cu微焊点界面金属间化合物生长速率[J]. 焊接学报, 2015, 36(5): 47-50,76.
shu
WANG Jianhua, MENG Gongge, SUN Fenglian. Study on growth rate of interfacial metallic compound in SAC305/Cu joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(5): 47-50,76.
Citation: WANG Jianhua, MENG Gongge, SUN Fenglian. Study on growth rate of interfacial metallic compound in SAC305/Cu joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(5): 47-50,76.
shu

SAC305/Cu微焊点界面金属间化合物生长速率

  • 哈尔滨理工大学 材料科学与工程学院, 哈尔滨 150040

基金项目: 国家自然科学基金资助项目(51075107)

Study on growth rate of interfacial metallic compound in SAC305/Cu joints

  • College of Material Science and Engineering, Harbin University of Science and Technology, Harbin 150040, China

  • 摘要: 界面金属间化合物(IMC)的生长速率是影响钎焊接头可靠性的重要因素. 文中研究了焊点尺寸、时效温度及镍镀层对SAC305/Cu微焊点界面IMC生长速率的影响. 结果表明,焊球尺寸为200,300,400和500 μm,时效温度为100,130,160 ℃条件下,界面IMC层厚度生长速率随时效时间平方根数值的升高而增长. 焊点尺寸由小变大,界面IMC层厚度更薄,IMC的生长速率也更小. 随着时效温度的升高,界面IMC生长速率增大. 镍镀层对界面IMC的生长速率有明显的抑制作用,即降低IMC生长速率,使其增厚变缓.
    Abstract: The growth rate of interfacial intermetallic compounds (IMC) is an important factor to influence the reliability of a solder joint. In this paper, the effects of joint size, temperature and pre-plated nickel coating on the growth rate of interfacial IMC of SAC305/Cu micro joint were studied. The results showed that the growth rate of the interfacial IMC increases with the square root of aging time rising under the conditions: solder size 200, 300, 400, 500 μm, and aging temperature 100, 130, 160 ℃. Along with the joint size getting larger, the interfacial IMC thickness is thinner with smaller IMC growth rate. The growth rate of interfacial IMC increases with the temperature rising. The plated nickel coating suppresses the growth rate of interfacial IMC obviously, i.e. reducing the growth rate of IMC.
  • [1] Jiun H H, Leng E P, Ding M, et al. A study on lead free SnAgCu solder system[C]// International Electronic Manufacturing Technology, Petaling Jaya Malaysia, Institute of Electrical and Electronics Engineers Inc. 2006: 450-455.
    [2] 张新平, 尹立孟, 于传宝. 电子和光子封装无铅钎料的研究和应用进展[J]. 材料研究学报, 2008, 22: 1-9. Zhang Xinping, Yin Limeng, Yu Chuanbao. Research and application of electronic and photonic packaging lead-free solder[J]. Journal of Materials Research, 2008, 22: 1-9.
    [3] 于大全, 段莉蕾. Sn-3.5Ag/Cu界面金属间化合物的生长行为研究[J]. 材料科学与工艺, 2005,13(5): 532-536. Yu Daquan, Duan Lilei. The growth behaviors of intermetallic compounds between Sn-3.5Ag and Cu substrate[J]. Material Science and Technology, 2005, 13(5): 532-536.
    [4] Wu A T, Chen M H, Huang C H. Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates[J]. Journal of Alloys and Compounds, 2009, 476(1/2): 252-256.
    [5] 肖 慧, 李晓延, 李凤辉. 热循环条件下SnAgCu/Cu焊点金属间化合物生长及焊点失效行为[J]. 材料工程, 2010, 10: 38-42. Xiao Hui, Li Xiaoyan, Li Fenghui. Growth kinetic of intermetallic compounds and failurebehavior for SnAgCu/Cu solder joints subjected to thermal cycling[J]. Materials Engineering, 2010,10: 38-42.
    [6] Deng X, Piotrowski G, Williams J J. Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints[J]. Journal of electronic Materials, 2003, 32: 1403-1413.
    [7] Kanlayasiri K, Ariga T. Influence of thermal aging on microhardness and microstructure influence of Sn0.3Ag0.7CuxIn lead-free solders[J]. Journal of Alloys and Compounds, 2010, 504: L5-L9.
    [8] 孙凤莲, 朱 艳. 微焊点的几何尺寸效应[J]. 哈尔滨理工大学学报, 2012, 17(2): 100-104. Sun Fenglian, Zhu Yan. Geometrical size effects on the performance of micro-joint[J]. Journal of Harbin University of Science and Technology, 2012, 17(2): 100-104.
    [9] 李望云, 尹立孟, 位 松, 等. 无铅电子封装互连焊点中的尺寸效应研究[J]. 重庆科技学院学报, 2011, 13(6): 130-133. Li Wangyun, Yin Limeng, Wei Song, et al. Theeffect of size in electronic packaging interconnect of lead-free solder joints[J]. Journal of Chongqin Institute of Technology, 2011,13(6): 130-133.
    [10] 王 磊, 卫国强, 薛明阳, 等. 等温时效对SnAgCu焊点界面组织及剪切强度的影响[J].特种铸造及有色合金, 2012, 32(7): 677-680. Wang Lei, Wei Guoqiang, Xue Mingyang, et al. The effect of isothermal aging on the interfacial microstructure and shear strength of SnAgCu solder[J]. Special Casting & Nonferrous Alloys, 2012, 32(7): 677-680.
    [11] Liu P, Yao P, Liu J. Evolutions of the interface and shear strength between SnAgCu-xNi solder and Cu substrate during isothermal aging at 150 ℃[J]. Journal of Alloys and Compounds, 2009, 486(1/2): 474-479.
    [12] Islam M N, Sharif A, Chan Y C. Effect of volume in interfacial reaction between eutectic Sn-3.5%Ag-0.5%Cu solder and Cu metallization in microelectronic packaging[J]. Journal of Electronic Materials, 2005, 34(2): 143-149.
    [13] 王丽凤, 孙凤莲, 吕 烨, 等. Sn-3.0Ag-0.5Cu-xNi无铅焊料及焊点的性能[J]. 焊接学报, 2009, 30(1): 9-12. Wang Lifeng, Sun Fenglian, Lü Ye, et al. The performance of Sn-3.0Ag-0.5Cu-xNi lead-free solder joints[J]. Transactions of China Welding Institution, 2009, 30(1): 9-12.
    [14] Zou Pengfei, Sun Fenglian, Liu Yang. Effect of Ni on the morphology of IMC and mechanical properties of SAC-Bi-Ni/Cu joints[C]// International Symposium on Advanced Packaging Materials, 2011: 267-271.
    [15] Liu Y, Sun F L. The effect of Ni and Bi elements to the growth rate of SnAgCu solder interfacial compounds[J]. The Chinese Journal of Nonferrous Metals, 2012, 22(2): 460-464.
    [16] 李勋平, 周敏波, 夏建民, 等. 界面耦合作用对Cu(Ni)/Sn-Ag-Cu/Cu(Ni)BGA焊点界面IMC形成与演化的影响[J]. 金属学报, 2011, 47(5): 611-619. Li Xunping, Zhou Minbo, Xia Jianmin, et al. Effect of interface coupling to the IMC formation and evolution of Cu (Ni)/Sn-Ag-Cu/Cu (Ni) BGA solder joint[J]. Metal Journal, 2011, 47(5): 611-619.
    [17] 王要利, 张柯柯, 韩丽娟, 等. Sn2.5Ag0.7Cu(0.1RE)/Cu焊点界面区微观组织与Cu6Sn5的生长动力学[J]. 中国有色金属学报, 2009, 19(4): 708-713. Wang Yaoli, Zhang Keke, Han Lijuan, et al. Microstructure of Sn2.5Ag0.7Cu (0.1RE)/Cu weld interface area and the growth kinetics of Cu6Sn5[J]. Chinese Journal of Nonferrous Metals, 2009, 19(4): 708-713.
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  • 收稿日期:  2013-11-18

SAC305/Cu微焊点界面金属间化合物生长速率

  • 哈尔滨理工大学 材料科学与工程学院, 哈尔滨 150040
    • 基金项目:  国家自然科学基金资助项目(51075107)
  • 收稿日期: 2013-11-18

摘要: 界面金属间化合物(IMC)的生长速率是影响钎焊接头可靠性的重要因素. 文中研究了焊点尺寸、时效温度及镍镀层对SAC305/Cu微焊点界面IMC生长速率的影响. 结果表明,焊球尺寸为200,300,400和500 μm,时效温度为100,130,160 ℃条件下,界面IMC层厚度生长速率随时效时间平方根数值的升高而增长. 焊点尺寸由小变大,界面IMC层厚度更薄,IMC的生长速率也更小. 随着时效温度的升高,界面IMC生长速率增大. 镍镀层对界面IMC的生长速率有明显的抑制作用,即降低IMC生长速率,使其增厚变缓.

English Abstract

王建华, 孟工戈, 孙凤莲. SAC305/Cu微焊点界面金属间化合物生长速率[J]. 焊接学报, 2015, 36(5): 47-50,76.
引用本文: 王建华, 孟工戈, 孙凤莲. SAC305/Cu微焊点界面金属间化合物生长速率[J]. 焊接学报, 2015, 36(5): 47-50,76.
shu
WANG Jianhua, MENG Gongge, SUN Fenglian. Study on growth rate of interfacial metallic compound in SAC305/Cu joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(5): 47-50,76.
Citation: WANG Jianhua, MENG Gongge, SUN Fenglian. Study on growth rate of interfacial metallic compound in SAC305/Cu joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(5): 47-50,76.
shu

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