高级检索

复杂背景下X射线BGA焊点气泡检测

李乐, 陈忠, 张宪民

李乐, 陈忠, 张宪民. 复杂背景下X射线BGA焊点气泡检测[J]. 焊接学报, 2015, 36(3): 80-84.
引用本文: 李乐, 陈忠, 张宪民. 复杂背景下X射线BGA焊点气泡检测[J]. 焊接学报, 2015, 36(3): 80-84.
shu
LI Le, CHEN Zhong, ZHANG Xianmin. Void detection of BGA solder joints under complex X-ray imaging background[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(3): 80-84.
Citation: LI Le, CHEN Zhong, ZHANG Xianmin. Void detection of BGA solder joints under complex X-ray imaging background[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(3): 80-84.
shu

复杂背景下X射线BGA焊点气泡检测

  • 华南理工大学 机械与汽车工程学院, 广州 510640

基金项目: 广东省科技计划资助项目(2012B011300016,2012B011300010)

Void detection of BGA solder joints under complex X-ray imaging background

  • School of Mechanical & Automotive Engineering, South China University of Technology, Guangzhou 510640, China

摘要

    摘要
  • 摘要: 基于全局阈值分割的焊点气泡提取不准确,且当焊点被遮挡造成的气泡提取困难时,导致球栅阵列(ball grid array,BGA)焊点气泡检测困难. 针对这些复杂背景下BGA焊点气泡的X射线缺陷检测问题,采用阈值分割、焊点圆度、焊点面积等标准提取未被遮挡的焊点,并提出了一种交互式射线轮廓提取方法完成被遮挡焊点轮廓的提取. 针对焊点气泡的特点,提出基于灰度形态学、直方图拉伸、模糊增强、BLOB分析综合处理的焊点气泡检测方法. 对比试验研究结果表明,该算法对复杂背景下BGA焊点气泡检测有较高准确率.
    Abstract: The void extraction method of solder joints based on global threshold segmentation is inaccurate. Moreover, once the solder joint in the image is shaded, the extraction of BGA solder joint's voids will become difficult. In order to detect the void defects of BGA solder joints under complex X-ray imaging background, it was detected that the unobstructed solder joints based on thresholding, solder roundness and solder area, and an interactive method of X-ray contour extraction to detect the obstructed solder joints was propose. According to the characteristics of solder buddle, an integrated method of solder joint's void extraction was presented based on grayscale morphology, histogram stretching, fuzzy enhancement and BLOB analysis. The result of comparison experiment shows that the method presented in this research possesses high accuracy in detecting the void defect of BGA solder joints.
    • HTML全文
    • 参考文献(10)
  • [1] 薛明阳, 卫国强, 金 亮, 等. 不同应变速率下BGA焊球剪切断裂试验与模拟分析[J]. 焊接学报, 2014, 35(3): 45-48. Xue Mingyang, Wei Guoqiang, Jin Liang, et al. Experimental and simulation analysis on the shear fracture for BGA solder ball under different strain rate[J].Transactions of the China Welding Institution, 2014, 35(3): 45-48
    [2] Sa-nguannam A, Srinonchat J. Analysis ball grid array defects by using new image technique[C]// Signal Processing, 2008. ICSP 2008. 9th International Conference, Beijing, 2008: 785-788.
    [3] Said A F, Bennett B L, Karam L J, et al. Robust automatic void detection in solder balls[C]// Acoustics Speech and Signal Processing (ICASSP), 2010 IEEE International Conference, Dallas, 2010: 1650-1653
    [4] Shao H P, Hyun D. BGA void detection in X-ray images based on a new blob[C]// Image and Signal Processing (CISP), 2011 4th International Congress, Shanghai, 2011: 1847-1850.
    [5] Otsu N. A threshold selection method from gray-level histograms[J]. IEEE Transactions on Systems, Man, and Cybernetics: Systems, 1979, 9(1): 62-66.
    [6] 薛家祥, 张丽玲. MAG焊熔池图像的灰度形态学分析[J]. 焊接学报, 2006, 27(4): 13-16. Xue Jiaxiang, Zhang Liling. Gray scale morphological analysis on molten pool image of metal active-gas[J]. Transactions of the China Welding Institution, 2006, 27(4): 13-16.
    [7] 陈 忠, 张宪民. 不均匀背景下芯片焊接气泡的X射线检测[J]. 焊接学报, 2010, 32(10): 65-68. Chen Zhong, Zhang Xianmin. X-ray inspection of DIE welding voids in an uneven background[J]. Transactions of the China Welding Institution, 2010, 32(10): 65-68.
    [8] Seul M, O'Gorman L, Sammon M J. Practical algorithms for image analysis: descriptions, examples, and code[M]. London: Cambridge University Press, 2008.
    [9] 刘习文, 蒋艳荣, 罗显光. 一种改进的图像模糊增强算法[J]. 计算机工程与应用, 2008, 44(4): 50-52. Liu Xiwen, Jiang Yanrong, Luo Xianguang. Improved image fuzzy-enhancement algorithm[J]. Computer Engineering and Applications, 2008, 44(4): 50-52.
    [10] 石美红, 王文光. 基于Blob算法的织物疵点检测算法的研究[J]. 现代电子技术, 2010, 24: 29-32. Shi Meihong, Wang Wenguang. Fabric defect detection algorithm based on blob algorithm[J]. Modern Electronic Technology, 2010, 24: 29-32
    • 相关文章
    • 施引文献
    • 资源附件(0)
计量
  • 文章访问数:  350
  • HTML全文浏览量:  17
  • PDF下载量:  107
  • 被引次数: 0
出版历程
  • 收稿日期:  2013-08-24

目录

摘要
HTML全文
    参考文献(10)
    相关文章
    施引文献
    资源附件(0)

    /

    返回文章
    返回

    网站版权 © 焊接杂志社焊接学报编辑部电话：0451-86323218地址：哈尔滨市松北区创新路2077号

    本系统由 北京仁和汇智信息技术有限公司 开发  百度统计