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驻留时间和加载速率对无铅焊点低周疲劳行为的影响

王超, 李晓延, 朱永鑫

王超, 李晓延, 朱永鑫. 驻留时间和加载速率对无铅焊点低周疲劳行为的影响[J]. 焊接学报, 2015, 36(3): 71-75.
引用本文: 王超, 李晓延, 朱永鑫. 驻留时间和加载速率对无铅焊点低周疲劳行为的影响[J]. 焊接学报, 2015, 36(3): 71-75.
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WANG Chao, LI Xiaoyan, ZHU Yongxin. Influence of dwell time and loading rate on low cycle fatigue behavior of lead-free solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(3): 71-75.
Citation: WANG Chao, LI Xiaoyan, ZHU Yongxin. Influence of dwell time and loading rate on low cycle fatigue behavior of lead-free solder joints[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(3): 71-75.
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驻留时间和加载速率对无铅焊点低周疲劳行为的影响

  • 北京工业大学 材料科学与工程学院, 北京 100124

基金项目: 国家自然科学基金资助项目(51275007)

Influence of dwell time and loading rate on low cycle fatigue behavior of lead-free solder joints

  • College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China

摘要

    摘要
  • 摘要: 在25 ℃下利用单轴微力疲劳试验机对96.5Sn-3Ag-0.5Cu无铅焊点进行不同驻留时间(1~20 s)和不同应变速率(0.01~0.08 mm/s)条件下的低周疲劳试验. 结果表明,在25 ℃下1~20 s的驻留时间对焊点的疲劳寿命影响不大;随着应变速率的加快,焊点的疲劳寿命逐渐降低,断裂机制逐渐由延性断裂向脆性断裂转变. 不同应变速率条件下的疲劳裂纹主要在焊点边缘钎料与金属间化合物(IMC)之间的界面处萌生,并在近IMC层的钎料内扩展. 焊点断口主要分为:裂纹扩展区和最终断裂区.
    Abstract: Low cycle fatigue tests on 96.5Sn-3Ag-0.5Cu solder joints were carried out using micro-uniaxial fatigue testing system at 25 ℃ with different dwell time (1-20 s) and different strain rates (0.01-0.08 mm/s). The results show that dwell time of 1-20 s has little influence on fatigue life of solder joints at 25 ℃. With the increasing of strain rates, the fatigue life of solder joints reduced gradually, and fracture mode was transformed from ductile fracture to brittle fracture. Fatigue cracks tended to initiate around the solder/IMC interfaces at the edge of the joints with different loading speeds, and then propagated within the solder proximately along the IMC interfaces. The fracture morphology of solder joints with different strain rates consisted mainly of propagation region and final fracture region.
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    • 参考文献(9)
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    [8] 芦 伟, 张 宁, 史耀武, 等. 加载速率对SnAgCu钎焊接头剪切强度的影响[J]. 焊接学报, 2010, 31(9): 57-60. Lu Wei, Zhang Ning, Shi Yaowu, et al. Effect of loading rate on shear strength of SnAgCu solder[J]. Transactions of the China Welding Institution, 2008, 31(9): 57-60.
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  • 收稿日期:  2013-08-13

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