Sn-0.3Ag-0.7Cu-xNd钎料显微组织及性能
Effect of Nd on properties and microstructure of Sn-0.3Ag-0.7Cu-xNd lead-free solder
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摘要: 研究了稀土元素Nd的添加量对超低银无铅钎料Sn-0.3Ag-0.7Cu的润湿性能、显微组织和力学性能的影响.结果表明,微量Nd元素的加入可以显著改善Sn-0.3Ag-0.7Cu超低银无铅钎料的润湿性能和焊点的力学性能,并且能够起到细化基体组织的作用.当钎料中Nd元素的质量分数达到0.1%时,钎料的综合性能最佳,基体组织最为均匀细化.虽然Ag元素含量的降低使钎料的性能有所下降,但是加入适量Nd元素后钎料的润湿性能已接近传统Sn-3.8Ag-0.7Cu钎料.Abstract: The effect of Nd on the wettability, microstructure and mechanical properties of Sn-0.3Ag-0.7Cu solder was investigated. The results indicated that the wettability of Sn-0.3Ag-0.7Cu was significantly improved with the addition of Nd and the microstructure of Sn-0.3Ag-0.7Cu was refined. When the amount of Nd reached to 0.1%, the wettability and mechanical properties of the solder were optimal. In addition, the wettability of Sn-0.3Ag-0.7Cu-0.1Nd approaching to Sn-3.8Ag-0.7Cu solder although the wettability of Sn-0.3Ag-0.7Cu solder is poorer due to the decrease of Ag adding.
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