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Sn-0.3Ag-0.7Cu-xNd钎料显微组织及性能

徐佳琛, 薛松柏, 薛鹏, 杨洁

徐佳琛, 薛松柏, 薛鹏, 杨洁. Sn-0.3Ag-0.7Cu-xNd钎料显微组织及性能[J]. 焊接学报, 2015, 36(1): 83-86.
引用本文: 徐佳琛, 薛松柏, 薛鹏, 杨洁. Sn-0.3Ag-0.7Cu-xNd钎料显微组织及性能[J]. 焊接学报, 2015, 36(1): 83-86.
shu
XU Jiachen, XUE Songbai, XUE Peng, YANG Jie. Effect of Nd on properties and microstructure of Sn-0.3Ag-0.7Cu-xNd lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(1): 83-86.
Citation: XU Jiachen, XUE Songbai, XUE Peng, YANG Jie. Effect of Nd on properties and microstructure of Sn-0.3Ag-0.7Cu-xNd lead-free solder[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(1): 83-86.
shu

Sn-0.3Ag-0.7Cu-xNd钎料显微组织及性能

  • 1.

    南京航空航天大学材料科学与技术学院, 南京 210016

  • 2.

    南京航空航天大学材料科学与技术学院, 南京 210016;南京信息职业技术学院机电学院, 南京 210016

基金项目: 江苏省普通高校研究生科研创新计划资助项目(CXZZ12_0148);新型钎焊材料与技术国家重点实验室开放课题资助项目(郑州机械研究所)SKLABFMT201102

Effect of Nd on properties and microstructure of Sn-0.3Ag-0.7Cu-xNd lead-free solder

  • 1.

    College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China

  • 2.

    College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China;College of Mechanical & Electrical Engineering, Nanjing College of Information Technology, Nanjing 210016, China

摘要

    摘要
  • 摘要: 研究了稀土元素Nd的添加量对超低银无铅钎料Sn-0.3Ag-0.7Cu的润湿性能、显微组织和力学性能的影响.结果表明,微量Nd元素的加入可以显著改善Sn-0.3Ag-0.7Cu超低银无铅钎料的润湿性能和焊点的力学性能,并且能够起到细化基体组织的作用.当钎料中Nd元素的质量分数达到0.1%时,钎料的综合性能最佳,基体组织最为均匀细化.虽然Ag元素含量的降低使钎料的性能有所下降,但是加入适量Nd元素后钎料的润湿性能已接近传统Sn-3.8Ag-0.7Cu钎料.
    Abstract: The effect of Nd on the wettability, microstructure and mechanical properties of Sn-0.3Ag-0.7Cu solder was investigated. The results indicated that the wettability of Sn-0.3Ag-0.7Cu was significantly improved with the addition of Nd and the microstructure of Sn-0.3Ag-0.7Cu was refined. When the amount of Nd reached to 0.1%, the wettability and mechanical properties of the solder were optimal. In addition, the wettability of Sn-0.3Ag-0.7Cu-0.1Nd approaching to Sn-3.8Ag-0.7Cu solder although the wettability of Sn-0.3Ag-0.7Cu solder is poorer due to the decrease of Ag adding.
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    • 参考文献(16)
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  • 收稿日期:  2014-10-08

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