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Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性

Wettability of Sn-0.3Ag-0.7Cu-xSb lead-free solders

  • 摘要: 研究了微量Sb元素对Sn-0.3Ag-0.7Cu无铅钎料润湿性的影响,采用润湿平衡法探讨了Sn-0.3Ag-0.7Cu-xSb钎料在不同氛围和不同钎剂条件下的润湿性能.结果表明,微量的Sb元素可以显著提高Sn-0.3Ag-0.7Cu无铅钎料润湿性.在氮气氛围条件下,Sn-0.3Ag-0.7Cu-xSb钎料的润湿性得到显著改善,主要基于氮气氛围减小熔融钎料的氧化.辅助不同的钎剂,钎料的润湿性差异较大,选择合适的钎剂可以明显提高Sn-0.3Ag-0.7Cu-xSb钎料的润湿性.

     

    Abstract: Effect of Sb on the wettability of Sn-0.3Ag-0.7Cu lead-free solders was investigated, with different atmospheres and fluxes, the wetting balance tester was used to analyze the wettability of Sn-0.3Ag-0.7Cu-xSb solders. The results indicates that small amount of Sb can enhance the wettability of Sn-0.3Ag-0.7Cu solders. With the N2 atmosphere, the wettability of Sn-0.3Ag-0.7Cu-xSb can be increased obviously, which can be attributed to the resistance of oxidation (molten solder). Combing different fluxes, the wettability of lead-free solder can represent variation, the suitable flux can improve the wettability of Sn-0.3Ag-0.7Cu-xSb solders.

     

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