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Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性

张亮, TuKN, 孙磊, 郭永环, 何成文

张亮, TuKN, 孙磊, 郭永环, 何成文. Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性[J]. 焊接学报, 2015, 36(1): 59-62.
引用本文: 张亮, TuKN, 孙磊, 郭永环, 何成文. Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性[J]. 焊接学报, 2015, 36(1): 59-62.
shu
ZHANG Liang, TU K N, SUN Lei, GUO Yonghuan, HE Chengwen. Wettability of Sn-0.3Ag-0.7Cu-xSb lead-free solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(1): 59-62.
Citation: ZHANG Liang, TU K N, SUN Lei, GUO Yonghuan, HE Chengwen. Wettability of Sn-0.3Ag-0.7Cu-xSb lead-free solders[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2015, 36(1): 59-62.
shu

Sn-0.3Ag-0.7Cu-xSb无铅钎料润湿性

  • 1.

    江苏师范大学机电工程学院, 徐州 221116;Department of Materials Science and Engineering, University of California, Los Angeles, CA 90095

  • 2.

    Department of Materials Science and Engineering, University of California, Los Angeles, CA 90095

  • 3.

    江苏师范大学机电工程学院, 徐州 221116

基金项目: 国家自然科学基金资助项目(51475220);江苏省自然科学基金资助项目(BK2012144);江苏省省属高校自然科学基金资助项目(12KJB460005)

Wettability of Sn-0.3Ag-0.7Cu-xSb lead-free solders

  • 1.

    School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China;Department of Materials Science and Engineering, University of California, Los Angeles 90095, USA

  • 2.

    Department of Materials Science and Engineering, University of California, Los Angeles 90095, USA

  • 3.

    School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China

摘要

    摘要
  • 摘要: 研究了微量Sb元素对Sn-0.3Ag-0.7Cu无铅钎料润湿性的影响,采用润湿平衡法探讨了Sn-0.3Ag-0.7Cu-xSb钎料在不同氛围和不同钎剂条件下的润湿性能.结果表明,微量的Sb元素可以显著提高Sn-0.3Ag-0.7Cu无铅钎料润湿性.在氮气氛围条件下,Sn-0.3Ag-0.7Cu-xSb钎料的润湿性得到显著改善,主要基于氮气氛围减小熔融钎料的氧化.辅助不同的钎剂,钎料的润湿性差异较大,选择合适的钎剂可以明显提高Sn-0.3Ag-0.7Cu-xSb钎料的润湿性.
    Abstract: Effect of Sb on the wettability of Sn-0.3Ag-0.7Cu lead-free solders was investigated, with different atmospheres and fluxes, the wetting balance tester was used to analyze the wettability of Sn-0.3Ag-0.7Cu-xSb solders. The results indicates that small amount of Sb can enhance the wettability of Sn-0.3Ag-0.7Cu solders. With the N2 atmosphere, the wettability of Sn-0.3Ag-0.7Cu-xSb can be increased obviously, which can be attributed to the resistance of oxidation (molten solder). Combing different fluxes, the wettability of lead-free solder can represent variation, the suitable flux can improve the wettability of Sn-0.3Ag-0.7Cu-xSb solders.
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    • 参考文献(13)
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  • 收稿日期:  2013-11-04

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