高级检索

覆纳米银铜粉焊膏的制备及其连接性分析

曹洋, 刘平, 魏红梅, 林铁松, 何鹏, 顾小龙

曹洋, 刘平, 魏红梅, 林铁松, 何鹏, 顾小龙. 覆纳米银铜粉焊膏的制备及其连接性分析[J]. 焊接学报, 2014, 35(10): 33-36.
引用本文: 曹洋, 刘平, 魏红梅, 林铁松, 何鹏, 顾小龙. 覆纳米银铜粉焊膏的制备及其连接性分析[J]. 焊接学报, 2014, 35(10): 33-36.
shu
CAO Yang, LIU Ping, WEI Hongmei, LIN Tiesong, HE Peng, GU Xiaolong. Preparation and connectivity of sintering paste containing copper particles covered by nano-silver[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(10): 33-36.
Citation: CAO Yang, LIU Ping, WEI Hongmei, LIN Tiesong, HE Peng, GU Xiaolong. Preparation and connectivity of sintering paste containing copper particles covered by nano-silver[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2014, 35(10): 33-36.
shu

覆纳米银铜粉焊膏的制备及其连接性分析

  • 1.

    浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室, 杭州 310030;哈尔滨工业大学先进焊接与连接国家重点实验室, 哈尔滨 150001

  • 2.

    浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室, 杭州 310030

  • 3.

    哈尔滨工业大学先进焊接与连接国家重点实验室, 哈尔滨 150001

基金项目: 国家自然科学基金资助项目(51275135,51321061)

Preparation and connectivity of sintering paste containing copper particles covered by nano-silver

  • 1.

    Zhejiang Province Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co. Ltd., Hangzhou 310030, China;State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

  • 2.

    Zhejiang Province Key Laboratory of Soldering & Brazing Materials and Technology, Zhejiang Metallurgical Research Institute Co. Ltd., Hangzhou 310030, China

  • 3.

    State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

摘要

    摘要
  • 摘要: 提出将纳米银与覆纳米银铜粉按照比例混合制备焊膏,用于低温连接纯度为99.99%的无氧紫铜板:首先利用液相化学还原法制备出平均粒径为20~35 nm的纳米银颗粒,同时利用化学镀制备覆纳米银铜粉颗粒.之后将纳米银与覆纳米银铜粉机械混合制备焊膏并在200℃烧结温度,10 MPa压力,保温30 min条件下烧结连接无氧紫铜板,并与纳米银焊膏单独烧结情况做对比分析,通过扫描电镜(SEM)观察连接接头形貌,其中纳米银与覆纳米银铜粉混合焊膏得到的烧结接头界面连接紧密,接头组织内有一定的孔隙率,其平均抗剪强度达20 MPa.
    Abstract: A kind of sintering paste mixed of nano-silver and copper particles covered by nano-silver was made, by which oxygen-free copper pad with 99.99% purity were connected at low temperature. Firstly, nano-silver particles whose average diameter were 20-35 nm were synthesized by liquid chemical reduction method. Meanwhile the copper particles covered by nano-silver were prepared by the method of chemical plating. Afterwards, these two kinds of particles were mixed by mechanical method to prepare sintering paste, by which oxygen free copper plate with 99.99% purity were joined under the condition of 10 MPa, 200℃ for 30 min. Finally, the microstructure of sintering section was observed by the scanning electron microscope(SEM). The results showed that the connection interface was sintered compactly, and certain porosities existed throughout the joint organization. The everge shear strength of the joints was about 20 MPa.
    • HTML全文
    • 参考文献(0)
    • 相关文章
    • 施引文献(14)

  • 期刊类型引用(7)

    1. 于江，杜荣茂，范彦龙，葛福琛，余果，张洪涛，杨涛. 冷喷涂Cu涂层辅助铝/钢异种金属电阻热扩散连接工艺分析. 焊接学报. 2024(12): 36-44 . 本站查看
    2. 肖勇，程钊，周建军，张建，罗丹，李明雨. 铝合金表面电弧喷涂Ag基涂层及其低温钎焊行为. 焊接学报. 2022(12): 27-34+114 . 本站查看
    3. 徐杰，王田. 焊接电流对镁合金/不锈钢电阻点焊接头的影响. 热加工工艺. 2019(01): 214-216 . 百度学术
    4. 李文亚，曹聪聪，杨夏炜，徐雅欣. 冷喷涂复合加工制造技术及其应用. 材料工程. 2019(11): 53-63 . 百度学术
    5. 张梦清，乔玉林，张仲，张伟，于鹤龙. 铜合金表面冷喷涂纯Cu/Cu基复合涂层的结构与性能. 科技经济导刊. 2019(31): 34+36 . 百度学术
    6. 汤贵庭. 镁/钢异种金属电阻点焊工艺研究. 热加工工艺. 2018(15): 225-228 . 百度学术
    7. 贾林，栗卓新，李红，Wolfgang Tillmann. 中间层对可伐合金4J29/钼组玻璃DM308激光焊接接头结合性能的影响. 焊接学报. 2018(11): 33-38+130 . 本站查看

    其他类型引用(7)

    • 资源附件(0)
计量
  • 文章访问数:  239
  • HTML全文浏览量:  3
  • PDF下载量:  173
  • 被引次数: 14
出版历程
  • 收稿日期:  2013-11-01

目录

摘要
HTML全文
    参考文献(0)
    相关文章
    施引文献(14)
    资源附件(0)

    /

    返回文章
    返回

    网站版权 © 焊接杂志社焊接学报编辑部电话：0451-86323218地址：哈尔滨市松北区创新路2077号

    本系统由 北京仁和汇智信息技术有限公司 开发  百度统计