细间距倒装芯片互连过程中焊点界面金属间化合物的形成与演化

田野; 吴懿平; 安兵; 龙旦风

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细间距倒装芯片互连过程中焊点界面金属间化合物的形成与演化

田野, 吴懿平, 安兵, 龙旦风

文章导航 > 焊接学报 > 2013 > (10): 100-104

田野, 吴懿平, 安兵, 龙旦风. 细间距倒装芯片互连过程中焊点界面金属间化合物的形成与演化[J]. 焊接学报, 2013, (10): 100-104.

引用本文:

田野, 吴懿平, 安兵, 龙旦风. 细间距倒装芯片互连过程中焊点界面金属间化合物的形成与演化[J]. 焊接学报, 2013, (10): 100-104.

TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (10): 100-104.

Citation:

TIAN Ye, WU Yiping, AN Bing, LONG Danfeng. Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow[J]. TRANSACTIONS OF THE CHINA WELDING INSTITUTION, 2013, (10): 100-104.

细间距倒装芯片互连过程中焊点界面金属间化合物的形成与演化

1.
河南工业大学机电工程学院, 郑州 450000;华中科技大学材料科学与工程学院, 武汉 430074
2.
华中科技大学材料科学与工程学院, 武汉 430074
3.
清华大学仪器与机械学系, 北京 100084

Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow

1.
Henan University of Technology, School of Mechanical and Electrical Engineering, Zhengzhou 450000, China;School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
2.
School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
3.
Department of Precision Instruments and Mechanology, Tsinghua University, Beijing 100084, China

摘要: 利用凸点间距为100μm,高度约为45μm,焊料成分为Sn-3.0Ag-0.5Cu(质量分数,%)(SAC305)的倒装芯片与树脂基板互连封装,研究芯片单侧凸点及芯片与BT基板焊点互连回流过程中界面金属间化合物(intermetalic compound,IMC)的形成和演化.结果表明,封装互连前,在芯片单侧镍焊盘界面上形成了长针状(Ni,Cu)₃Sn₄和薄层状Ni₃P,由于反应过程中焊料基体中Cu原子的大量消耗,没有形成典型的(Cu,Ni)₆Sn₅.封装互连过程中,由于大量Cu原子从铜界面扩散到镍界面,促使镍焊盘界面(Ni,Cu)₃Sn₄逐渐转化成(Cu,Ni)₆Sn₅,形貌由针状转变成短棒状,反应后(Cu,Ni)₆Sn₅成为主要IMC层;在铜焊盘界面上,形成了一层短棒状的(Cu,Ni)₆Sn₅,由于从镍焊盘界面扩散过来的Ni原子对Cu₃Sn生长的限制作用,反应后没有形成典型的Cu₃Sn.
- 无铅焊料 /
- 金属间化合物 /
- 倒装芯片 /
- 界面反应
Abstract: Through the cyclic load-unload test of nano-indentation method,the effects of maximum load on cycling mechanics behavior for two kinds micro-solder joints of Sn-3.0Ag- 0.5Cu/Cu and Sn-0.3Ag-0.7Cu/Cu were investigated.The results indicated that the cycling F-h curves that before closed showed a hysteresis loop.The area of hysteresis loop and indentation residual depth of micro-soldered joints increased with the increase of the maximum load.The cumulative damage of microsoldered joints increased.When the maximum load was given, the area of hysteresis loop and increments of residual indentation depth decreased gradually with the loading time increasing.Indentation creep C of micro-soldered joints decreased with the increase of the maximum load.At the same time,indentation creep C of micro-soldered joints sharply decreased at first and then plateaued with the loading time increasing.Indentation creep C of Sn-3.0Ag-0.5Cu/Cu micro-soldered joint was less than that of Sn-0.3Ag-0.7Cu/Cu micro-soldered joint.
- lead-free solder /
- intermetallic compound /
- flip chip /
- interfacial reaction

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细间距倒装芯片互连过程中焊点界面金属间化合物的形成与演化

1. 河南工业大学机电工程学院, 郑州 450000;华中科技大学材料科学与工程学院, 武汉 430074

2. 华中科技大学材料科学与工程学院, 武汉 430074

3. 清华大学仪器与机械学系, 北京 100084

收稿日期: 2012-07-20

关键词:

摘要: 利用凸点间距为100μm,高度约为45μm,焊料成分为Sn-3.0Ag-0.5Cu(质量分数,%)(SAC305)的倒装芯片与树脂基板互连封装,研究芯片单侧凸点及芯片与BT基板焊点互连回流过程中界面金属间化合物(intermetalic compound,IMC)的形成和演化.结果表明,封装互连前,在芯片单侧镍焊盘界面上形成了长针状(Ni,Cu)₃Sn₄和薄层状Ni₃P,由于反应过程中焊料基体中Cu原子的大量消耗,没有形成典型的(Cu,Ni)₆Sn₅.封装互连过程中,由于大量Cu原子从铜界面扩散到镍界面,促使镍焊盘界面(Ni,Cu)₃Sn₄逐渐转化成(Cu,Ni)₆Sn₅,形貌由针状转变成短棒状,反应后(Cu,Ni)₆Sn₅成为主要IMC层;在铜焊盘界面上,形成了一层短棒状的(Cu,Ni)₆Sn₅,由于从镍焊盘界面扩散过来的Ni原子对Cu₃Sn生长的限制作用,反应后没有形成典型的Cu₃Sn.

English Abstract

Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow

1. Henan University of Technology, School of Mechanical and Electrical Engineering, Zhengzhou 450000, China;School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

2. School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

3. Department of Precision Instruments and Mechanology, Tsinghua University, Beijing 100084, China

Received Date: 2012-07-20

Keywords:

Abstract: Through the cyclic load-unload test of nano-indentation method,the effects of maximum load on cycling mechanics behavior for two kinds micro-solder joints of Sn-3.0Ag- 0.5Cu/Cu and Sn-0.3Ag-0.7Cu/Cu were investigated.The results indicated that the cycling F-h curves that before closed showed a hysteresis loop.The area of hysteresis loop and indentation residual depth of micro-soldered joints increased with the increase of the maximum load.The cumulative damage of microsoldered joints increased.When the maximum load was given, the area of hysteresis loop and increments of residual indentation depth decreased gradually with the loading time increasing.Indentation creep C of micro-soldered joints decreased with the increase of the maximum load.At the same time,indentation creep C of micro-soldered joints sharply decreased at first and then plateaued with the loading time increasing.Indentation creep C of Sn-3.0Ag-0.5Cu/Cu micro-soldered joint was less than that of Sn-0.3Ag-0.7Cu/Cu micro-soldered joint.

田野, 吴懿平, 安兵, 龙旦风. 细间距倒装芯片互连过程中焊点界面金属间化合物的形成与演化[J]. 焊接学报, 2013, (10): 100-104.

引用本文:

田野, 吴懿平, 安兵, 龙旦风. 细间距倒装芯片互连过程中焊点界面金属间化合物的形成与演化[J]. 焊接学报, 2013, (10): 100-104.

Citation:

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细间距倒装芯片互连过程中焊点界面金属间化合物的形成与演化

Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow

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细间距倒装芯片互连过程中焊点界面金属间化合物的形成与演化

1. 河南工业大学机电工程学院, 郑州 450000;华中科技大学材料科学与工程学院, 武汉 430074 2. 华中科技大学材料科学与工程学院, 武汉 430074 3. 清华大学仪器与机械学系, 北京 100084

English Abstract

Evolution of interfacial intermetallic compound in small solder joint of fine pitch flip chip during reflow

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目录

1. 河南工业大学机电工程学院, 郑州 450000;华中科技大学材料科学与工程学院, 武汉 430074

2. 华中科技大学材料科学与工程学院, 武汉 430074

3. 清华大学仪器与机械学系, 北京 100084